MC9S12XA256CAL Freescale Semiconductor, MC9S12XA256CAL Datasheet - Page 899

IC MCU 256K FLASH 112-LQFP

MC9S12XA256CAL

Manufacturer Part Number
MC9S12XA256CAL
Description
IC MCU 256K FLASH 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheets

Specifications of MC9S12XA256CAL

Core Processor
HCS12X
Core Size
16-Bit
Speed
80MHz
Connectivity
EBI/EMI, I²C, IrDA, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
91
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
112-LQFP
No. Of I/o's
91
Eeprom Memory Size
4KB
Ram Memory Size
16KB
Cpu Speed
80MHz
No. Of Timers
1
No. Of Pwm Channels
8
Digital Ic Case Style
LQFP
Rohs Compliant
Yes
Processor Series
S12XA
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
16 KB
Interface Type
CAN, I2C, SCI, SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
91
Number Of Timers
12
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
EVB9S12XDP512E
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (10 bit, 16 Channel)
Package
112LQFP
Family Name
HCS12
Maximum Speed
40 MHz
Operating Supply Voltage
2.5|5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S12XA256CAL
Manufacturer:
AD
Quantity:
101
Part Number:
MC9S12XA256CAL
Manufacturer:
FREESCALE
Quantity:
7 765
Part Number:
MC9S12XA256CAL
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S12XA256CAL
Manufacturer:
FREESCALE
Quantity:
7 765
Part Number:
MC9S12XA256CAL
Manufacturer:
FREESCALE
Quantity:
20 000
Chapter 23
DQ256 Port Integration Module (S12XDQ256PIMV2)
Introduction
The S12XD family port integration module (below referred to as PIM) establishes the interface between
the peripheral modules including the non-multiplexed external bus interface module (S12X_EBI) and the
I/O pins for all ports. It controls the electrical pin properties as well as the signal prioritization and
multiplexing on shared pins.
This document covers the description of:
Most I/O pins can be configured by register bits to select data direction and drive strength, to enable and
select pull-up or pull-down devices. Interrupts can be enabled on specific pins resulting in status flags.
The I/O’s of 2 MSCAN and 3 SPI modules can be routed from their default location to alternative port
pins.
23.0.1
A full-featured PIM module includes these distinctive registers:
Freescale Semiconductor
Port A, B used as address output of the S12X_EBI and Port C, D used as data I/O of the S12X_EBI
Port E associated with the S12X_EBI control signals and the IRQ, XIRQ interrupt inputs
Port K associated with address output and control signals of the S12X_EBI
Port T connected to the Enhanced Capture Timer (ECT) module
Port S associated with 2 SCI and 1 SPI modules
Port M associated with 3 MSCAN modules
Port P connected to the PWM and 2 SPI modules — inputs can be used as an external interrupt
source
Port H associated with 1 SCI module — inputs can be used as an external interrupt source
Port J associated with 1 MSCAN, 1 SCI, and 1 IIC module — inputs can be used as an external
interrupt source
Port AD0 and AD1 associated with one 8-channel andone 16-channel ATD module
Data and data direction registers for Ports A, B, C, D, E, K, T, S, M, P, H, J, AD0, and AD1 when
used as general-purpose I/O
Features
The implementation of the PIM is device dependent. Therefore some
functions are not available on certain derivatives or 112-pin and 80-pin
package options.
MC9S12XDP512 Data Sheet, Rev. 2.21
NOTE
901

Related parts for MC9S12XA256CAL