MCF5232CAB80 Freescale Semiconductor, MCF5232CAB80 Datasheet - Page 20

IC MPU 32BIT COLDF 80MHZ 160-QFP

MCF5232CAB80

Manufacturer Part Number
MCF5232CAB80
Description
IC MPU 32BIT COLDF 80MHZ 160-QFP
Manufacturer
Freescale Semiconductor
Series
MCF523xr
Datasheet

Specifications of MCF5232CAB80

Core Processor
Coldfire V2
Core Size
32-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, I²C, SPI, UART/USART
Peripherals
DMA, WDT
Number Of I /o
61
Program Memory Type
ROMless
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
160-QFP
Maximum Clock Frequency
80 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Program Memory Size
8KB
Cpu Speed
80MHz
Embedded Interface Type
I2C, SPI, UART
Digital Ic Case Style
QFP
No. Of Pins
160
Supply Voltage Range
1.4V To 1.6V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCF5232CAB80
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Mechanicals/Pinouts and Part Numbers
6.2.2
Figure 7
20
15X
e
Y
E
shows MCF5235CVMxxx, MCF5234CVMxxx, and MCF5233CVMxx package dimensions.
S
X
Package Dimensions—256 MAPBGA
0.20
16
15
14
LASER MARK FOR PIN A1
IDENTIFICATION IN
THIS AREA
13
12
11
VIEW M-M
10
MCF523x Integrated Microprocessor Hardware Specification, Rev. 4
D
7
6
5
15X
S
4
3
e
2
1
Figure 7. 256 MAPBGA Package Outline
G
M
A
B
C
D
E
F
H
J
K
L
N
P
R
T
METALIZED MARK FOR
PIN A1 IDENTIFICATION
IN THIS AREA
K
256X
M
M
0.25
0.10
b
3
M
M
Z
Z
X
Y
A
A2
A1
Z
ROTATED 90 CLOCKWISE
NOTES:
1.
2.
3.
4.
5.
4
DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS AND
TOLERANCES PER ASME Y14.5M, 1994.
DIMENSION b IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO DATUM PLANE Z.
DATUM Z (SEATING PLANE) IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
PARALLELISM MEASUREMENT SHALL
EXCLUDE ANY EFFECT OF MARK ON TOP
SURFACE OF PACKAGE.
DETAIL K
DIM
A1
A2
A
D
E
S
b
e
°
MILLIMETERS
MIN
1.25
0.27
0.40
256X
17.00 BSC
17.00 BSC
1.16 REF
1.00 BSC
0.50 BSC
0.15
MAX
1.60
0.47
0.60
Freescale Semiconductor
Z
0.30
5
Z

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