MCF5232CAB80 Freescale Semiconductor, MCF5232CAB80 Datasheet - Page 46

• Manufacturer Part Number: MCF5232CAB80
• Description: IC MPU 32BIT COLDF 80MHZ 160-QFP
• Manufacturer: Freescale Semiconductor
• Series: MCF523xr

Specifications of MCF5232CAB80

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, SPI, UART/USART
• Peripherals: DMA, WDT
• Number Of I /o: 61
• Program Memory Type: ROMless
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 160-QFP
• Maximum Clock Frequency: 80 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Program Memory Size: 8KB
• Cpu Speed: 80MHz
• Embedded Interface Type: I2C, SPI, UART
• Digital Ic Case Style: QFP
• No. Of Pins: 160
• Supply Voltage Range: 1.4V To 1.6V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Document Revision History
46
Rev. No.
1.5
1.6
1.7
1.8
2
3
4
• Removed Overview, Features, Modes of Operation, and Address Multiplexing sections. This
• Removed list of documentation table in
•
•
• Added
• Updated 196MAPBGA package dimensions,
•
•
• Removed second sentence from
• Removed third and fourth paragraphs from
•
•
•
• Corrected position of spec D5 in
•
•
• Added part number MCF5235CVF150 in
MCF523x Integrated Microprocessor Hardware Specification, Rev. 4
information can be found in the MCF5235 Reference Manual.
always available on our web site.
Table
Table
Table
QSPI_CS1 pin location from “—” to 139 for the 160QFP device.
Figure
ERXDV, ERXER, and
ETXEN, ETXER,
(ETXD[3:0], ETXEN, ETXER,
Section 5.2.1, “Supply Voltage Sequencing and Separation
V
Section 5.2.1, “Supply Voltage Sequencing and Separation
voltage level from 1.5V to 3.3V throughout section.
Section 5.2.1.1, “Power Up
Table
Table
DDPLL
Table 26. MCF5235EC Revision History (continued)
9: Changed core supply voltage (V
10: Changed max f
2: Changed SD_CKE pin location from 139 to “—” for the 160QFP device. Changed
14: Added DACKn and DREQn to footnote.
9, added PLL supply voltage row
Section 5.2.1, “Supply Voltage Sequencing and Separation
8: Changed pin 139 label from “SD_CKE/QSPI_CS1” to “QSPI_CS1/SD_CKE”.
to match rest of document.
ETXCLK),”
ERXCLK),”
ICO
Sequence” first bullet, changed “Use 1 µs” to “Use 1 ms”.
frequency from “75 MHz” to “150 MHz”.
regarding no minimum frequency requirement for TXCLK.
ETXCLK),”
Substantive Change(s)
Figure
and
Section 7.10.1, “MII Receive Signal Timing (ERXD[3:0],
Section 7.10.2, “MII Transmit Signal Timing (ETXD[3:0],
Section 8,
14.
DD
Table 6
as this feature is not supported on this device.
) from 1.35-1.65 to 1.4-1.6.
Section 7.10.2, “MII Transmit Signal Timing
Figure
“Documentation.”. An up-to-date list is
3.
Cautions” changed PLLV
Cautions” Changed V
Cautions.”
Freescale Semiconductor
DDPLL
DD
to