UPD70F3744GJ-GAE-AX Renesas Electronics America, UPD70F3744GJ-GAE-AX Datasheet - Page 908

• Manufacturer Part Number: UPD70F3744GJ-GAE-AX
• Description: MCU 32BIT V850ES/JX3 144-LQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Jx3r

Specifications of UPD70F3744GJ-GAE-AX

• Core Processor: RISC
• Core Size: 32-Bit
• Speed: 32MHz
• Connectivity: CSI, EBI/EMI, I²C, UART/USART
• Peripherals: DMA, LVD, PWM, WDT
• Number Of I /o: 128
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 40K x 8
• Voltage - Supply (vcc/vdd): 2.85 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

V850ES/JJ3
R01UH0016EJ0400 Rev.4.00
Sep 30, 2010
3rd
2nd
Edition
Addition of CHAPTER 29 (i) KYOCERA KINSEKI CORPORATION: Crystal
resonator (T
Addition of CHAPTER 29 (ii) Murata Mfg. Co. Ltd.: Ceramic resonator (T
to +80°C)
Addition of CHAPTER 31 RECOMMENDED SOLDERING CONDITIONS
Addition of
Addition of 3.4.4 (1) (a) Internal ROM (384 KB)
Addition of 3.4.4 (1) (b) Internal ROM (512 KB)
Addition of 3.4.4 (2) (a) Internal RAM (32 KB)
Addition of 3.4.4 (2) (b) Internal RAM (40 KB)
Modification of Figure 4-8 Block Diagram of Type D-2
Modification of Figure 4-11 Block Diagram of Type E-2
Modification of Figure 4-12 Block Diagram of Type E-3
Modification of Figure 4-13 Block Diagram of Type G-1
Modification of Figure 4-14 Block Diagram of Type G-2
Modification of Figure 4-15 Block Diagram of Type G-3
Modification of Figure 4-16 Block Diagram of Type G-5
Modification of Figure 4-17 Block Diagram of Type G-6
Modification of Figure 4-18 Block Diagram of Type G-12
Modification of Figure 4-20 Block Diagram of Type L-2
Modification of Figure 4-22 Block Diagram of Type N-2
Modification of Figure 4-24 Block Diagram of Type U-1
Modification of Figure 4-25 Block Diagram of Type U-5
Modification of Figure 4-26 Block Diagram of Type U-6
Modification of Figure 4-27 Block Diagram of Type U-7
Modification of Figure 4-28 Block Diagram of Type U-8
Modification of Figure 4-29 Block Diagram of Type U-9
Modification of Figure 4-30 Block Diagram of Type U-10
Modification of Figure 4-31 Block Diagram of Type U-11
Modification of Figure 4-32 Block Diagram of Type U-12
Modification of Figure 4-33 Block Diagram of Type U-13
Modification of Figure 4-34 Block Diagram of Type U-14
Modification of Figure 4-35 Block Diagram of Type U-15
Modification of Figure 4-36 Block Diagram of Type AA-1
Modification of 15.3 (5) UARTAn status register (UAnSTR)
Modification of 27.1 Features
Modification of Figure 27-1 Flash Memory Mapping
Modification of Figure 28-4 Memory Spaces Where Debug Monitor Programs Are
Allocated
Modification of Table B-1 Major Differences Between V850ES/JJ3 and
V850ES/JJ2
Addition of APPENDIX F REVISION HISTORY
μ
PD70F3743 and
A
= −10 to +70°C)
μ
PD70F3744
Description
APPENDIX F REVISION HISTORY
A
= −20
CHAPTER 29 ELECTRICAL
SPECIFICATIONS
CHAPTER 31
RECOMMENDED SOLDERING
CONDITIONS
Throughout
CHAPTER 3 CPU FUNCTION
CHAPTER 4 PORT
FUNCTIONS
CHAPTER 15
ASYNCHRONOUS SERIAL
INTERFACE A (UARTA)
CHAPTER 27 FLASH
MEMORY
CHAPTER 28 ON-CHIP
DEBUG FUNCTION
APPENDIX B MAJOR
DIFFERENCES BETWEEN
V850ES/JJ3 AND V850ES/JJ2
APPENDIX F REVISION
HISTORY
Applied to:
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