SAB-C167SR-LM HA+ Infineon Technologies, SAB-C167SR-LM HA+ Datasheet - Page 88
SAB-C167SR-LM HA+
Manufacturer Part Number
SAB-C167SR-LM HA+
Description
IC MCU 16BIT MQFP-144
Manufacturer
Infineon Technologies
Series
C16xxr
Datasheet
1.SAB-C167CR-LM_HA.pdf
(89 pages)
Specifications of SAB-C167SR-LM HA+
Core Processor
C166
Core Size
16-Bit
Speed
25MHz
Connectivity
CAN, EBI/EMI, SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
111
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
144- BSQFP
Data Bus Width
16 bit
Data Ram Size
4 KB
Interface Type
1xUSART, 1xSSC
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
111
Number Of Timers
9
Operating Supply Voltage
5 V
Maximum Operating Temperature
+ 70 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
0 C
On-chip Adc
10 bit, 16 Channel
Packages
PG-MQFP-144
Max Clock Frequency
25.0 MHz
Sram (incl. Cache)
4.0 KByte
A / D Input Lines (incl. Fadc)
16
Program Memory
0.0 KByte
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Details
Other names
B167SRLMHAZNP
B167SRLMHAZXP
SABC167SRLMHAX
SP000103456
B167SRLMHAZXP
SABC167SRLMHAX
SP000103456
Figure 25
You can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/products.
Data Sheet
P-BGA-176-2 (Plastic Ball Grid Array Package)
A14
13 x 1 = 13
1.5
ø0.5
1
4x
15
13
±0.5
+0.14
-0.16
±0.2
±1
86
ø0.3
ø0.1
176x
P1
B
M
M
A1
A
C
Index Marking
Index Marking
(sharp edge)
A
B
C
0.2
C
Package Outlines
Dimensions in mm
V3.3, 2005-02
C167CR
C167SR
GPA09430