MC9S12UF32PB Freescale Semiconductor, MC9S12UF32PB Datasheet - Page 111
MC9S12UF32PB
Manufacturer Part Number
MC9S12UF32PB
Description
IC MCU 32K FLASH 30MHZ 64LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet
1.MC9S12UF32PB.pdf
(128 pages)
Specifications of MC9S12UF32PB
Core Processor
HCS12
Core Size
16-Bit
Speed
30MHz
Connectivity
ATA, Compact Flash, EBI/EMI, Memory Stick, MMC, SCI, SD, Smart Media, USB
Peripherals
POR, WDT
Number Of I /o
41
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
3.5K x 8
Voltage - Supply (vcc/vdd)
2.25 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
64-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S12UF32PB
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
MC9S12UF32PBE
Manufacturer:
XILINX
Quantity:
101
Company:
Part Number:
MC9S12UF32PBE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
A.2.2 NVM Reliability
The reliability of the NVM blocks is guaranteed by stress test during qualification, constant process
monitors and burn-in to screen early life failures.
The program/erase cycle count on the sector is incremented every time a sector or mass erase event is
executed.
Freescale Semiconductor
NOTE:
Conditions are shown in Table A-4 unless otherwise noted
Num C
NOTES:
1. Data Retention at maximum guaranteed device operating temperature up to 1 year.
1
2
1
C
C Flash number of Program/Erase cycles
All values shown in Table A-10 are target values and subject to further extensive
characterization.
Data Retention at an average junction temperature of
T
Javg
= 85
o
C
Table A-10 NVM Reliability Characteristics
Rating
System on a Chip Guide — 9S12UF32DGV1/D V01.05
Symbol
t
NVMRET
n
FLPE
10,000
Min
15
Typ Max
Cycles
Years
Unit
111