MC9S12UF32PB Freescale Semiconductor, MC9S12UF32PB Datasheet - Page 111

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MC9S12UF32PB

Manufacturer Part Number
MC9S12UF32PB
Description
IC MCU 32K FLASH 30MHZ 64LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12UF32PB

Core Processor
HCS12
Core Size
16-Bit
Speed
30MHz
Connectivity
ATA, Compact Flash, EBI/EMI, Memory Stick, MMC, SCI, SD, Smart Media, USB
Peripherals
POR, WDT
Number Of I /o
41
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
3.5K x 8
Voltage - Supply (vcc/vdd)
2.25 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
64-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-

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A.2.2 NVM Reliability
The reliability of the NVM blocks is guaranteed by stress test during qualification, constant process
monitors and burn-in to screen early life failures.
The program/erase cycle count on the sector is incremented every time a sector or mass erase event is
executed.
Freescale Semiconductor
NOTE:
Conditions are shown in Table A-4 unless otherwise noted
Num C
NOTES:
1. Data Retention at maximum guaranteed device operating temperature up to 1 year.
1
2
1
C
C Flash number of Program/Erase cycles
All values shown in Table A-10 are target values and subject to further extensive
characterization.
Data Retention at an average junction temperature of
T
Javg
= 85
o
C
Table A-10 NVM Reliability Characteristics
Rating
System on a Chip Guide — 9S12UF32DGV1/D V01.05
Symbol
t
NVMRET
n
FLPE
10,000
Min
15
Typ Max
Cycles
Years
Unit
111

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