SA5211D/01,112 NXP Semiconductors, SA5211D/01,112 Datasheet

IC TRANSIMP AMP 180MHZ 14-SOIC

SA5211D/01,112

Manufacturer Part Number
SA5211D/01,112
Description
IC TRANSIMP AMP 180MHZ 14-SOIC
Manufacturer
NXP Semiconductors
Datasheet

Specifications of SA5211D/01,112

Amplifier Type
Transimpedance
Number Of Circuits
1
Output Type
Differential
-3db Bandwidth
180MHz
Current - Supply
26mA
Current - Output / Channel
4mA
Voltage - Supply, Single/dual (±)
4.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Slew Rate
-
Gain Bandwidth Product
-
Current - Input Bias
-
Voltage - Input Offset
-
Other names
568-2449-5
935275219112
SA5211D/01
1. Description
2. Features
3. Applications
c
c
The SA5211 is a 28 k transimpedance, wide-band, low noise amplifier with
differential outputs, particularly suitable for signal recovery in fiber optic receivers.
The part is ideally suited for many other RF applications as a general purpose gain
block.
SA5211
Transimpedance amplifier (180 MHz)
Rev. 03 — 07 October 1998
Extremely low noise: 1.8 pA / Hz
Single 5 V supply
Large bandwidth: 180 MHz
Differential outputs
Low input/output impedances
High power supply rejection ratio
28 k differential transresistance
Fiber optic receivers, analog and digital
Current-to-voltage converters
Wide-band gain block
Medical and scientific Instrumentation
Sensor preamplifiers
Single-ended to differential conversion
Low noise RF amplifiers
RF signal processing
Product specification

Related parts for SA5211D/01,112

SA5211D/01,112 Summary of contents

Page 1

SA5211 Transimpedance amplifier (180 MHz) Rev. 03 — 07 October 1998 1. Description The SA5211 transimpedance, wide-band, low noise amplifier with differential outputs, particularly suitable for signal recovery in fiber optic receivers. The part is ideally ...

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Philips Semiconductors 4. Pinning information 4.1 Pinning Fig 1. Pin configuration. 5. Ordering information Table 1: Ordering information Type number Package Name Description SA5211D SO14 plastic small outline package; 14 leads; body width 3 Limiting values Table 2: ...

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Philips Semiconductors Table 3: Symbol amb Static characteristics Table 4: DC electrical characteristics Min and Max limits apply over operating temperature range and ...

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Philips Semiconductors Table 5: AC electrical characteristics Typical data and Min and Max limits apply at V Symbol Parameter [ 1pF n S PSRR power supply rejection ratio ( ...

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Philips Semiconductors 9. Test circuits NETWORK ANALYZER S-PARAMETER TEST SET PORT CC1 CC2 OUT 0 DUT OUT 50 GND GND 1 Fig 2. Test circuits 1 and ...

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Philips Semiconductors Fig 3. Test circuits 3 and 4. 9397 750 07427 Product specification PORT ...

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Philips Semiconductors GND 0.1 F Fig 4. Test circuits 5 and 6. 9397 750 07427 Product specification ...

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Philips Semiconductors PULSE GEN. Fig 5. Test circuit 7. 9397 750 07427 Product specification V V CC1 CC2 0 OUT 0 DUT 33 OUT 0 GND GND 2 1 Test Circuit 7 Rev. ...

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Philips Semiconductors 2.00 1.60 1.20 0.80 0.40 0.00 –0.40 –0.80 –1.20 –1.60 –2.00 –100 –80 Fig 6. Test circuit 8. 9397 750 07427 Product specification Typical Differential Output Voltage vs Current Input 5V OUT + IN ...

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Philips Semiconductors 10. Typical performance characteristics ° ° ° Fig 7. Typical performance characteristics. 9397 750 07427 Product specification Transimpedance amplifier (180 MHz) ° ° ¥ ° Rev. 03 — 07 October 1998 SA5211 ° ° ° ° ° ° ...

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Philips Semiconductors ° W ° ° ° ° W ° Fig 8. Typical performance characteristics. (cont.) 9397 750 07427 Product specification Transimpedance amplifier (180 MHz) ° W ° ° ° ° ° Rev. 03 — 07 October 1998 SA5211 ¥ ...

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Philips Semiconductors ° ° D ± ° Fig 9. Typical performance characteristics. (cont.) 9397 750 07427 Product specification Transimpedance amplifier (180 MHz) ° ° ° ° ° Rev. 03 — 07 October 1998 SA5211 ° © Philips Electronics N.V. 2001. ...

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Philips Semiconductors Fig 10. Typical performance characteristics. (cont.) 11. Theory of operation Transimpedance amplifiers have been widely used as the preamplifier in fiber-optic receivers. The SA5211 is a wide bandwidth (typically 180 MHz) transimpedance amplifier designed primarily for input currents ...

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Philips Semiconductors Q – are bonded to an external pin, V stage. The output impedance is about 17 single-ended. For ease of performance evaluation resistor is used in series with each output to match to a ...

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Philips Semiconductors strongly determined by the quiescent current of Q bandwidth; however not dependent upon the internal Miller-capacitance. The measured wideband noise was 41 nA RMS in a 200 MHz bandwidth. 14. Dynamic range calculations The electrical dynamic ...

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Philips Semiconductors I = where e = electron charge = 1.6 Responsivity Assuming a data rate of 400 Mbaud (Bandwidth 200 MHz), the noise parameter Z may be calculated as ...

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Philips Semiconductors Fig 11. SA5211 – Block diagram. This represents the maximum limit attainable with the SA5211 operating at 200 MHz bandwidth, with a half mark/half space digital transmission at 850nm wavelength. PHOTODIODE Fig 12. Transimpedance amplifier. Fig 13. Shunt-series ...

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Philips Semiconductors 15. Application information Package parasitics, particularly ground lead inductances and parasitic capacitances, can significantly degrade the frequency response. Since the SA5211 has differential outputs which can feed back signals to the input by parasitic package or board layout ...

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Philips Semiconductors D1 R2 LED 220 LED PKDET 100pF THRESH 3 GND FLAG 5 47k JAM CCD 7 C11 C10 V CCA .01 F GND ...

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Philips Semiconductors Fig 15. SA5211 Bonding diagram. 15.1 Die sales disclaimer Due to the limitations in testing high frequency and other parameters at the die level, and the fact that die electrical characteristics may shift after packaging, die electrical parameters ...

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Philips Semiconductors processes are utilized for wafer sawing and die pick and place into waffle pack carriers impossible to guarantee 100% functionality through this process. There is no post waffle pack testing performed on individual die. Since Philips ...

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Philips Semiconductors 16. Package outline SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

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Philips Semiconductors 17. Soldering 17.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...

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Philips Semiconductors During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. ...

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Philips Semiconductors 18. Revision history Table 7: Revision history Rev Date CPCN 03 19981007 853-1799 20142 02 19981007 853-1799 20142 01 19950426 853-1799 15170 9397 750 07427 Product specification Description Product specification; third version; supersedes second version SA5211_2 of 1998 ...

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Philips Semiconductors 19. Data sheet status [1] [2] Data sheet status Product status Objective data Development Preliminary data Qualification Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product ...

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Philips Semiconductors Philips Semiconductors - a worldwide company Argentina: see South America Australia: Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Tel. +43 160 101, Fax. +43 160 101 1210 Belarus: Tel. +375 17 220 0733, Fax. ...

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Philips Semiconductors Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . ...

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This datasheet has been download from: www.datasheetcatalog.com Datasheets for electronics components. ...

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