USBULC6-2M6 STMicroelectronics, USBULC6-2M6 Datasheet
USBULC6-2M6
Specifications of USBULC6-2M6
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USBULC6-2M6 Summary of contents
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... Ultra large bandwidth ESD protection (pin view) Figure 1. Functional diagram (top view) Description The USBULC6-2M6 is a monolithic, application specific discrete device dedicated to ESD protection of high speed interfaces. Its ultra low line capacitance provides high bandwidth and secures a high level of signal integrity without compromizing the protection of downstream sensitive chips against the most stringent characterized ESD strikes ...
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... Any I/O pin to ground 240 MHz R Any I/O pin to ground MHz R Any I/O pin to ground MHz R Ground not connected 240 MHz R Ground not connected USBULC6-2M6 Value ±15 ±15 ±25 -55 to +150 150 260 Value Min. Typ. Max 0 8/20 µ 8/20 µs ...
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... Characteristics Relative variation of leakage current versus junction temperature (typical values) [T =25° (° 100 Crosstalk measurements F (Hz) 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G Remaing voltage on I/O2 after the USBULC6-2M6 during negative ESD surge (15 kV Air) 100ns/Div 125 3/10 ...
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... Remaing voltage on V USBULC6-2M6 during positive ESD surge (15 kV Air) 10V/Div Figure 10. Eye diagram PCB only 400 mV amplitude 480 Mbps Horiz: 350 ps/div Vert: 100 mV/div Figure 12. Eye diagram PCB + USBULC6-2M6 100 nF, 400 mV amplitude 480 Mbps 4/10 after the Figure 9. BUS 10V/Div 100ns/Div Figure 11 ...
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... USBULC6-2M6 2 Application example Figure 13. One differential line 3 Ordering information scheme Figure 14. Ordering information scheme Product Designation Ultra low capacitance Breakdown Voltage Volts Number of lines protected lines Package µQFN - 6 leads D+ I/ GND 2 plane 3 I/O2 D- Application example I/ 100 nF 4 I/O2 USB ULC 5/10 ...
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... ( ( 0.50 0.25 [0.020] [0.010] 0.65 [0.026] 0.30 [0.012] USBULC6-2M6 Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. 0.50 0.55 0.60 0.020 0.022 0.024 0.00 0.02 0.05 0.000 0.001 0.002 0.18 0.25 0.30 0.007 0.010 0.012 1.45 0.057 1.00 0.039 0.50 ...
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... USBULC6-2M6 5 Recommendation on PCB assembly 5.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness) Figure 16. Stencil opening dimensions. b) General Design Rule Stencil thickness ( 125 µm Aspect Ratio Aspect Area 2. Reference design a) Stencil opening thickness: 100 µm b) Stencil opening for leads: Opening to footprint ratio is 90% ...
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... Minimize air convection currents in the reflow oven to avoid component movement. 8/10 ® recommended soldering reflow profile for PCB mounting 3°C/s max 3°C/s max 150 sec 90 to 150 sec USBULC6-2M6 2°C/s recommended 2°C/s recommended 6°C/s max 6°C/s max Time (min) Time (min) ...
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... USBULC6-2M6 6 Ordering information Table 4. Ordering information Order code USBULC6-2M6 1. The marking can be rotated by 90° to diferentiate assembly location 7 Revision history Table 5. Document revision history Date 29-Nov-2007 Marking Package Weight (1) T µQFN 2.2 mg Revision 1 First issue Ordering information Base qty Delivery mode ...
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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 10/10 Please Read Carefully: © 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com USBULC6-2M6 ...