MCF5272VM66 Freescale Semiconductor, MCF5272VM66 Datasheet - Page 29

• Manufacturer Part Number: MCF5272VM66
• Description: IC MPU 66MHZ COLDFIRE 196-MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF527xr

Specifications of MCF5272VM66

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
• Peripherals: DMA, WDT
• Number Of I /o: 32
• Program Memory Size: 16KB (4K x 32)
• Program Memory Type: ROM
• Ram Size: 1K x 32
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 196-MAPBGA
• Family Name: MCF5xxx
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 66MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 3.3V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 196
• Package Type: MA-BGA
• Cpu Speed: 66MHz
• Embedded Interface Type: UART, QSPI, USB, TDM
• Digital Ic Case Style: BGA
• No. Of Pins: 196
• Supply Voltage Range: 3V To 3.6V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Compliant

Paragraph
Number
20.12 Reset Operation ...................................................................................................................... 20-21
21.1 Overview .................................................................................................................................... 21-1
21.2 JTAG Test Access Port and BDM Debug Port .......................................................................... 21-2
21.3 TAP Controller ........................................................................................................................... 21-3
21.4 Boundary Scan Register ............................................................................................................. 21-4
21.5 Instruction Register .................................................................................................................... 21-7
21.6 Restrictions ................................................................................................................................ 21-8
21.7 Non-IEEE 1149.1 Operation ...................................................................................................... 21-8
22.1 Pinout ......................................................................................................................................... 22-1
22.2 Package Dimensions .................................................................................................................. 22-2
23.1 Maximum Ratings ...................................................................................................................... 23-1
23.2 DC Electrical Specifications ...................................................................................................... 23-3
23.3 AC Electrical Specifications ...................................................................................................... 23-5
23.4 Debug AC Timing Specifications ............................................................................................ 23-13
23.5 SDRAM Interface Timing Specifications ................................................................................ 23-14
23.6 Fast Ethernet AC Timing Specifications ................................................................................. 23-17
Freescale Semiconductor
20.12.1 Master Reset ............................................................................................................... 20-22
20.12.2 Normal Reset .............................................................................................................. 20-23
20.12.3 Software Watchdog Timer Reset Operation ............................................................... 20-24
20.12.4 Soft Reset Operation ................................................................................................... 20-25
23.1.1 Supply, Input Voltage, and Storage Temperature ........................................................... 23-1
23.1.2 Operating Temperature ................................................................................................... 23-2
23.1.3 Resistance ....................................................................................................................... 23-2
23.2.1 Output Driver Capability and Loading ........................................................................... 23-3
23.3.1 Clock Input and Output Timing Specifications .............................................................. 23-5
23.3.2 Processor Bus Input Timing Specifications .................................................................... 23-6
23.3.3 Processor Bus Output Timing Specifications ................................................................. 23-8
23.6.1 MII Receive Signal Timing (E_RxD[3:0], E_RxDV, E_RxER, and E_RxCLK) ........ 23-17
23.6.2 MII Transmit Signal Timing (E_TxD[3:0], E_TxEN, E_TxER, E_TxCLK) .............. 23-18
23.6.3 MII Async Inputs Signal Timing (CRS and COL) ....................................................... 23-19
23.6.4 MII Serial Management Channel Timing (MDIO and MDC) ..................................... 23-20
MCF5272 ColdFire
Table of Contents (Continued)
IEEE 1149.1 Test Access Port (JTAG)
Electrical Characteristics
®
Integrated Microprocessor User’s Manual, Rev. 3
Mechanical Data
Chapter 21
Chapter 22
Chapter 23
Title
Number
Page
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