BGM1014,115 NXP Semiconductors, BGM1014,115 Datasheet - Page 7

• Manufacturer Part Number: BGM1014,115
• Description: MMIC AMPLIFIER SOT-363
• Manufacturer: NXP Semiconductors
• Type: MMIC Wideband Amplifierr

Specifications of BGM1014,115

• Package / Case: SC-70-6, SC-88, SOT-363
• Current - Supply: 17mA ~ 25mA
• Frequency: 0Hz ~ 2.2GHz
• Gain: 31.5dB ~ 33dB
• Noise Figure: 4.2dB ~ 4.3dB
• P1db: 12.5dBm ~ 12.9dBm
• Rf Type: ISM
• Test Frequency: 1GHz
• Voltage - Supply: 5 V ~ 6 V
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.5 V
• Supply Current: 30 mA
• Operating Temperature Range: - 40 C to + 85 C
• Mounting Style: SMD/SMT
• Manufacturer's Type: Broadband Amplifier
• Number Of Channels: 1
• Operating Supply Voltage (min): 4.5V
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (max): 5.5V
• Package Type: SOT-363
• Mounting: Surface Mount
• Pin Count: 6
• Noise Figure (typ): 4.1@2200MHzdB
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-2077-2; 934059057115; BGM1014 T/R

Philips Semiconductors
9. Application information
9397 750 14499
Product data sheet
Figure 9
internally matched to 50
impedance matching is also achieved with a 75
DC blocking capacitors C1 and C2 should be not more than 100 pF for applications above
100 MHz. Their values can be used to fine-tune the input and output impedance.
For the RF choke, optimal results are obtained with a good quality chip inductor like the
TDK MLG1608 (0603) or a wire-wound SMD. The value of the inductor can be used to
fine-tune the output impedance.
The RF choke and supply decoupling components should be located as close as possible
to the MMIC.
Ground paths must be as short as possible. The printed-circuit board (PCB) top ground
plane must be as close as possible to the MMIC, and ideally directly beneath it. When
using vias, use at least 3 vias for the top ground plane in order to limit ground path
inductance. Supply decoupling with C3 should be from pin 1 to the same top ground
plane.
Fig 9. Typical application circuit
shows a typical application circuit for the BGM1014 MMIC. The device is
RF in
Rev. 01 — 11 March 2005
C1
and therefore does not need any external matching. Good
IN
6
GND1
BGM1014
4
SOT363
1
V
GND2
S
2, 5
3
OUT
load. The value of the input and output
L1
C2
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
001aac488
C3
MMIC wideband amplifier
V
RF out
S
BGM1014
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