BGM1014,115 NXP Semiconductors, BGM1014,115 Datasheet - Page 7

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BGM1014,115

Manufacturer Part Number
BGM1014,115
Description
MMIC AMPLIFIER SOT-363
Manufacturer
NXP Semiconductors
Type
MMIC Wideband Amplifierr
Datasheet

Specifications of BGM1014,115

Package / Case
SC-70-6, SC-88, SOT-363
Current - Supply
17mA ~ 25mA
Frequency
0Hz ~ 2.2GHz
Gain
31.5dB ~ 33dB
Noise Figure
4.2dB ~ 4.3dB
P1db
12.5dBm ~ 12.9dBm
Rf Type
ISM
Test Frequency
1GHz
Voltage - Supply
5 V ~ 6 V
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.5 V
Supply Current
30 mA
Operating Temperature Range
- 40 C to + 85 C
Mounting Style
SMD/SMT
Manufacturer's Type
Broadband Amplifier
Number Of Channels
1
Operating Supply Voltage (min)
4.5V
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (max)
5.5V
Package Type
SOT-363
Mounting
Surface Mount
Pin Count
6
Noise Figure (typ)
4.1@2200MHzdB
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-2077-2
934059057115
BGM1014 T/R

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BGM1014,115
Manufacturer:
KYOCERA
Quantity:
7 600
Philips Semiconductors
9. Application information
9397 750 14499
Product data sheet
Figure 9
internally matched to 50
impedance matching is also achieved with a 75
DC blocking capacitors C1 and C2 should be not more than 100 pF for applications above
100 MHz. Their values can be used to fine-tune the input and output impedance.
For the RF choke, optimal results are obtained with a good quality chip inductor like the
TDK MLG1608 (0603) or a wire-wound SMD. The value of the inductor can be used to
fine-tune the output impedance.
The RF choke and supply decoupling components should be located as close as possible
to the MMIC.
Ground paths must be as short as possible. The printed-circuit board (PCB) top ground
plane must be as close as possible to the MMIC, and ideally directly beneath it. When
using vias, use at least 3 vias for the top ground plane in order to limit ground path
inductance. Supply decoupling with C3 should be from pin 1 to the same top ground
plane.
Fig 9. Typical application circuit
shows a typical application circuit for the BGM1014 MMIC. The device is
RF in
Rev. 01 — 11 March 2005
C1
and therefore does not need any external matching. Good
IN
6
GND1
BGM1014
4
SOT363
1
V
GND2
S
2, 5
3
OUT
load. The value of the input and output
L1
C2
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
001aac488
C3
MMIC wideband amplifier
V
RF out
S
BGM1014
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