PK60X256VMD100 Freescale Semiconductor, PK60X256VMD100 Datasheet - Page 21

• Manufacturer Part Number: PK60X256VMD100
• Description: IC ARM CORTEX MCU 256K 144-MAP
• Manufacturer: Freescale Semiconductor
• Series: Kinetisr

Specifications of PK60X256VMD100

• Core Processor: ARM Cortex-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, IrDA, SDHC, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I²S, LVD, POR, PWM, WDT
• Number Of I /o: 100
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 33x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 144-LBGA
• Processor Series: Kinetis
• Core: ARM Cortex M4
• Data Ram Size: 64 KB
• Interface Type: UART, SPI, I2C, I2S, CAN
• Maximum Clock Frequency: 100 MHz
• Number Of Programmable I/os: 100
• Operating Supply Voltage: 1.71 V to 3.6 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

4. 15pF load
5.3 Thermal specifications
5.3.1 Thermal operating requirements
5.3.2 Thermal attributes
1.
6 Peripheral operating requirements and behaviors
All digital I/O switching characteristics assume:
Freescale Semiconductor, Inc.
Single-
layer
(1s)
Four-
layer
(2s2p)
Single-
layer
(1s)
Four-
layer
(2s2p)
—
—
—
1. output pins
Board
type
Symbol
T
T
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
J
A
R
R
R
R
R
R
Ψ
Symbol Description
θJA
θJA
θJMA
θJMA
θJB
θJC
JT
Die junction temperature
Ambient temperature
Description
Thermal resistance, junction to ambient
(natural convection)
Thermal resistance, junction to ambient
(natural convection)
Thermal resistance, junction to ambient
(200 ft./min. air speed)
Thermal resistance, junction to ambient
(200 ft./min. air speed)
Thermal resistance, junction to board
Thermal resistance, junction to case
Thermal characterization parameter,
junction to package top outside center
(natural convection)
K60 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
Table 9. Thermal operating requirements
Preliminary
52
44
43
38
33
11
2
LQFP
144
Peripheral operating requirements and behaviors
50
30
41
27
17
10
2
MAPBGA
144
Min.
–40
–40
TBD
TBD
TBD
TBD
TBD
TBD
TBD
MAPBGA
81
TBD
TBD
TBD
TBD
TBD
TBD
TBD
LQFP
80
Max.
125
105
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit
1
1
1
1
2
3
4
°C
°C
Notes
21