PK60X256VMD100 Freescale Semiconductor, PK60X256VMD100 Datasheet - Page 35

• Manufacturer Part Number: PK60X256VMD100
• Description: IC ARM CORTEX MCU 256K 144-MAP
• Manufacturer: Freescale Semiconductor
• Series: Kinetisr

Specifications of PK60X256VMD100

• Core Processor: ARM Cortex-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, IrDA, SDHC, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I²S, LVD, POR, PWM, WDT
• Number Of I /o: 100
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 33x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 144-LBGA
• Processor Series: Kinetis
• Core: ARM Cortex M4
• Data Ram Size: 64 KB
• Interface Type: UART, SPI, I2C, I2S, CAN
• Maximum Clock Frequency: 100 MHz
• Number Of Programmable I/os: 100
• Operating Supply Voltage: 1.71 V to 3.6 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

where
Freescale Semiconductor, Inc.
• Writes_subsystem — minimum number of writes to each FlexRAM location for
• EEPROM — allocated FlexNVM for each EEPROM subsystem based on DEPART;
• EEESPLIT — FlexRAM split factor for subsystem; entered with the Program
• EEESIZE — allocated FlexRAM based on DEPART; entered with Program Partition
• Write_efficiency —
• n
subsystem (each subsystem can have different endurance)
entered with Program Partition command
Partition command
command
nvmcycd
• 0.25 for 8-bit writes to FlexRAM
• 0.50 for 16-bit or 32-bit writes to FlexRAM
— data flash cycling endurance
Figure 9. EEPROM backup writes to FlexRAM
K60 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
Preliminary
Peripheral operating requirements and behaviors
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