ISL3179EFBZ-T7A Intersil, ISL3179EFBZ-T7A Datasheet - Page 4

• Manufacturer Part Number: ISL3179EFBZ-T7A
• Description: IC TXRX RS485/422 ESD 8SOIC
• Manufacturer: Intersil

Specifications of ISL3179EFBZ-T7A

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Absolute Maximum Ratings
V
Input Voltages
Input/Output Voltages
Short Circuit Duration
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Operating Conditions
Temperature Range
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
Electrical Specifications
DC CHARACTERISTICS
Driver Differential V
Change in Magnitude of Driver
Differential V
Complementary Output States
Driver Common-Mode V
Change in Magnitude of Driver
Common-Mode V
Complementary Output States
Logic Input High Voltage
Logic Input Low Voltage
Logic Input Current
Input Current (A, B, A/Y, B/Z)
Y or Z Output Leakage Current
Driver Short-Circuit Current,
V
Receiver Differential Threshold
Voltage
Receiver Input Hysteresis
Receiver Output High Voltage
Receiver Output Low Voltage
1. θ
2. For θ
CC
DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
A, B, Y, Z, A/Y, B/Z . . . . . . . . . . . . . . . . . . . . . . . . . . . -9V to +13V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (V
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ISL3179EF . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +125°C
ISL3179EI, ISL3180EI . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
O
Brief TB379 for details.
= High or Low
to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
JA
is measured with the component mounted on a high effective thermal conductivity (with direct attach for DFN) test board in free air. See Tech
JC
PARAMETER
, the “case temp” location is the center of the exposed metal pad on the package underside.
OUT
OUT
for
OUT
for
OUT
4
Test Conditions: V
SYMBOL
I
ΔV
ΔV
ΔV
OSD1
V
V
V
V
V
I
I
V
I
V
IN1
IN2
OZ
OD
OC
OH
TH
OL
IH
OD
OC
IL
TH
R
R
No Load
R
(Note 12)
R
R
R
DI, DE, RE
DI, DE, RE
DI = DE = RE = 0V or V
DE = 0V, V
3.6V
DE = 0V, -7V ≤V
DE = V
-7V ≤ V
V
I
I
O
O
CM
L
L
L
L
L
L
= -12mA, V
= +10mA, V
= 100Ω (RS-422) (Figure 1A), (Note 12)
= 54Ω (RS-485) (Figure 1A)
= 60Ω, -7V ≤V
= 54Ω or 100Ω (Figure 1A)
= 54Ω or 100Ω (Figure 1A)
= 54Ω or 100Ω (Figure 1A)
CC
= 0V
CC
CM
ISL3179E, ISL3180E
= 3.0V to 3.6V; Typicals are at V
CC
, -7V ≤V
CC
≤ 12V
+0.3V)
TEST CONDITIONS
ID
= 0V or
ID
Y
= -50mV
= -200mV
CM
Y
or V
or V
≤12V (Figure 1B),
Z
CC
≤12V, ISL3180E Only
Z
≤12V (Note 5)
V
V
IN
IN
Thermal Information
Thermal Resistance (Typical, Note 1, 2)
Maximum Junction Temperature (Plastic Package) . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
8 Ld SOIC Package . . . . . . . . . . . . . . .
14 Ld SOIC Package . . . . . . . . . . . . . .
8 Ld MSOP Package . . . . . . . . . . . . . .
10 Ld DFN Package. . . . . . . . . . . . . . .
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
= 12V
= -7V
CC
= 3.3V, T
TEMP
(°C)
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
25
A
= +25°C. (Note 3)
(Note 13)
V
CC
-160
-200
MIN
1.5
1.5
-40
-2
2
2
-
-
-
-
-
-
-
-
-
- 0.5
TYP
0.01
0.02
2.3
2.1
28
θ
2
2
-
-
-
-
-
-
-
-
-
-
-
JA
137
160
128
(°C/W)
46
(Note 13) UNITS
MAX
±250
V
V
220
0.2
2.5
0.2
0.8
-50
0.4
40
CC
CC
2
-
-
-
-
-
-
θ
April 22, 2008
JC
N/A
N/A
N/A
FN6365.2
3.5
(°C/W)
mV
mV
mA
µA
µA
µA
µA
V
V
V
V
V
V
V
V
V
V