PMEG4010CPA,115 NXP Semiconductors, PMEG4010CPA,115 Datasheet
PMEG4010CPA,115
Specifications of PMEG4010CPA,115
PMEG4010CPA,115
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PMEG4010CPA,115 Summary of contents
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PMEG4010CPA 1 A low V Rev. 1 — 24 August 2010 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier in common cathode configuration with an integrated guard ring for stress protection, encapsulated in ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number PMEG4010CPA HUSON3 plastic thermal enhanced ultra thin small outline package; 4. Marking Table 4. Type number PMEG4010CPA 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode ...
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... NXP Semiconductors Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per device, one diode loaded P tot amb T stg [1] Device mounted on a ceramic PCB °C prior to surge. [ [3] Reflow soldering is the only recommended soldering method. [4] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. ...
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... NXP Semiconductors duty cycle = th(j-a) (K/W) 1 0.75 0 0.33 0.25 0.2 0.1 0.05 10 0.02 0. −3 − FR4 PCB, standard footprint Fig 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.25 0.2 ...
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... NXP Semiconductors 2 10 duty cycle = 1 0.75 Z th(j-a) 0.5 (K/W) 0.33 0.25 0.2 10 0.1 0.05 0.02 0 0.01 1 −3 − Ceramic PCB standard footprint 2 3 Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 7. Characteristics Table 7. ° unless otherwise specified. ...
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... NXP Semiconductors (A) (1) 1 (2) −1 10 (3) (4) (5) −2 10 −3 10 −4 10 0.0 0.2 0.4 = 150 °C ( 125 °C ( °C ( °C ( −40 °C ( Fig 4. Forward current as a function of forward voltage; typical values = 25 ° MHz; T amb Fig 6. Diode capacitance as a function of reverse voltage; typical values ...
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... NXP Semiconductors 0.6 P F(AV) (W) (2) 0.4 (1) 0.2 0.0 0.0 0.5 = 150 ° (1) δ = 0.1 (2) δ = 0.2 (3) δ = 0.5 (4) δ Fig 7. Average forward power dissipation as a function of average forward current; typical values 1.5 (1) I F(AV) (A) (2) 1.0 (3) 0.5 (4) 0 100 FR4 PCB, standard footprint = 150 ° ...
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... NXP Semiconductors 1.5 (1) I F(AV) (A) (2) 1.0 (3) 0.5 (4) 0 100 Ceramic PCB standard footprint 150 ° (1) δ (2) δ kHz (3) δ kHz (4) δ kHz Fig 11. Average forward current as a function of ambient temperature; typical values PMEG4010CPA Product data sheet 1 A low V 006aac437 1.5 ...
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... NXP Semiconductors 8. Test information D.U.T. I Ω × ( Fig 13. Reverse recovery time test circuit and waveforms Fig 14. Duty cycle definition The current ratings for the typical waveforms as shown in calculated according to the equations RMS F AV 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications ...
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... NXP Semiconductors 9. Package outline Fig 15. Package outline SOT1061 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PMEG4010CPA [1] For further information and the availability of packing methods, see PMEG4010CPA Product data sheet 1 A low V 1 ...
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... NXP Semiconductors 11. Soldering 2.3 Reflow soldering is the only recommended soldering method. Fig 16. Reflow soldering footprint SOT1061 PMEG4010CPA Product data sheet 1 A low V 1.05 0.6 0.55 solder paste = solder lands solder resist occupied area All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors 12. Revision history Table 9. Revision history Document ID Release date PMEG4010CPA v.1 20100824 PMEG4010CPA Product data sheet 1 A low V Data sheet status Change notice Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 1 — 24 August 2010 PMEG4010CPA dual MEGA Schottky barrier rectifier ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 14. Contact information For more information, please visit: For sales office addresses, please send an email to: ...
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... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 9 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 10 Packing information ...