DSPIC30F2010-30I/SPG Microchip Technology, DSPIC30F2010-30I/SPG Datasheet - Page 243

• Manufacturer Part Number: DSPIC30F2010-30I/SPG
• Description: 16BIT 30MIPS DSPIC, 30F2010, DIP28
• Manufacturer: Microchip Technology
• Series: DsPIC30Fr

Specifications of DSPIC30F2010-30I/SPG

• Core Frequency: 30MHz
• Embedded Interface Type: I2C, SPI, UART
• No. Of I/o's: 20
• Flash Memory Size: 12KB
• Supply Voltage Range: 2.5V To 5.5V
• Operating Temperature Range: -40°C To
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
 2004 Microchip Technology Inc.
Architecture
Trademark
Example:
dsPIC30F2010AT-30I/PF = 30 MIPS, Industrial temp., TQFP package, Rev. A
Memory Size in Bytes
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
Device ID
Flash
d s P I C 3 0 F 2 0 1 0 AT- 3 0 I / P F - E S
Advance Information
Temperature
I = Industrial -40°C to +85°C
E = Extended High Temp -40°C to +125°C
PT = TQFP 10x10
PT = TQFP 12x12
PF = TQFP 14x14
P
SO = SOIC
SP = SPDIP
ML = QFN 6x6 or 8x8
S
W
A,B,C… = Revision Level
Custom ID (3 digits) or
Engineering Sample (ES)
dsPIC30F
= DIP
= Die (Waffle Pack)
= Die (Wafers)
T = Tape and Reel
Package
DS70082E-page 241
.
Speed
20 = 20 MIPS
30 = 30 MIPS