S29GL032N90TFI040 Spansion Inc., S29GL032N90TFI040 Datasheet - Page 78

• Manufacturer Part Number: S29GL032N90TFI040
• Description: IC, FLASH, 32MBIT, 90NS, TSOP-48
• Manufacturer: Spansion Inc.

Specifications of S29GL032N90TFI040

• Memory Type: Flash
• Memory Size: 32Mbit
• Ic Interface Type: CFI, Parallel
• Access Time: 90ns
• Supply Voltage Range: 2.7V To 3.6V
• Memory Case Style: TSOP
• No. Of Pins: 48
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

17.5
78
LAE064-64-Ball Fortified Ball Grid Array (BGA) 9 x 9 mm Package
PACKAGE
JEDEC
SYMBOL
SD / SE
MD
ME
A1
A2
D1
E1
eD
eE
φb
A
D
E
N
0.40
0.60
0.50
MIN
---
9.00 mm x 9.00 mm
PACKAGE
9.00 BSC.
9.00 BSC.
7.00 BSC.
7.00 BSC.
1.00 BSC.
1.00 BSC.
0.50 BSC.
LAE 064
NONE
NOM
0.60
N/A
64
---
---
---
8
8
MAX
1.40
0.70
S29GL-N MirrorBit
---
---
PROFILE HEIGHT
STANDOFF
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH - D DIRECTION
BALL PITCH - E DIRECTION
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTE
D a t a
®
Flash Family
S h e e t
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010
4.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
6
7
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF
EXCEPT AS NOTED).
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
DEPOPULATED BALLS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
S29GL-N_01_12 October 29, 2008
3623 \ 16-038.12 \ 1.16.07