DSPIC30F3013-20I/ML Microchip Technology, DSPIC30F3013-20I/ML Datasheet - Page 22

• Manufacturer Part Number: DSPIC30F3013-20I/ML
• Description: IC,DSP,16-BIT,CMOS,LLCC,44PIN,PLASTIC
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F3013-20I/ML

• Rohs Compliant: YES
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 20
• Program Memory Size: 24KB (8K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-QFN
• Package: 44QFN EP
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 3.3|5 V
• Data Bus Width: 16 Bit
• Number Of Programmable I/os: 30
• Interface Type: I2C/SPI/UART
• On-chip Adc: 10-chx12-bit
• Number Of Timers: 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: DSPIC30F301320IML

dsPIC30F2011/2012/3012/3013
2.3
The dsPIC DSC devices feature a 16/16-bit signed
fractional divide operation, as well as 32/16-bit and
16/16-bit signed and unsigned integer divide opera-
tions, in the form of single instruction iterative divides.
The following instructions and data sizes are
supported:
1.
2.
3.
4.
5.
The 16/16 divides are similar to the 32/16 (same number
of iterations), but the dividend is either zero-extended or
sign-extended during the first iteration.
TABLE 2-1:
DS70139G-page 22
DIVF
DIV.sd
DIV.s
DIV.ud
DIV.u
DIVF - 16/16 signed fractional divide
DIV.sd - 32/16 signed divide
DIV.ud - 32/16 unsigned divide
DIV.s - 16/16 signed divide
DIV.u - 16/16 unsigned divide
Instruction
Divide Support
DIVIDE INSTRUCTIONS
Signed fractional divide: Wm/Wn → W0; Rem → W1
Signed divide: (Wm+1:Wm)/Wn → W0; Rem → W1
Signed divide: Wm/Wn → W0; Rem → W1
Unsigned divide: (Wm+1:Wm)/Wn → W0; Rem → W1
Unsigned divide: Wm/Wn → W0; Rem → W1
The divide instructions must be executed within a
REPEAT
(e.g., a series of discrete divide instructions) will not
function correctly because the instruction flow depends
on RCOUNT. The divide instruction does not
automatically set up the RCOUNT value and it must,
therefore, be explicitly and correctly specified in the
REPEAT instruction, as shown in
executes the target instruction {operand value+1}
times). The REPEAT loop count must be setup for 18
iterations of the DIV/DIVF instruction. Thus, a
complete divide operation requires 19 cycles.
Function
Note:
loop.
The divide flow is interruptible; however,
the user needs to save the context as
appropriate.
Any
© 2010 Microchip Technology Inc.
other
form
Table 2-1
of
execution
(REPEAT