SPC5604PGF0MLQ6 Freescale Semiconductor, SPC5604PGF0MLQ6 Datasheet - Page 47

• Manufacturer Part Number: SPC5604PGF0MLQ6
• Description: IC MCU 32BIT 512KB FLASH 144LQFP
• Manufacturer: Freescale Semiconductor
• Series: MPC56xx Qorivvar

Specifications of SPC5604PGF0MLQ6

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CAN, FlexRay, LIN, SPI, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 108
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 64K x 8
• Ram Size: 40K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 30x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

R
ambient thermal resistance, R
interface material, the mounting arrangement on printed circuit board, or change the thermal dissipation on the printed circuit
board surrounding the device.
To determine the junction temperature of the device in the application when heat sinks are not used, the Thermal
Characterization Parameter (
the top center of the package case using
The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T thermocouple epoxied
to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the
package. A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of wire extending from the
junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects
of the thermocouple wire.
References:
JEDEC specifications are available on the WEB at http://www.jedec.org.
Freescale Semiconductor
JC
1.
2.
3.
is device related and cannot be influenced by the user. The user controls the thermal environment to change the case to
R
R
R
where:
T

P
Semiconductor Equipment and Materials International
3081 Zanker Road
San Jose, CA 95134
[phone]
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at
800-854-7179 or 303-397-7956.
C.E. Triplett and B. Joiner, An Experimental Characterization of a 272 PBGA Within an Automotive Engine Controller
Module, Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
G. Kromann, S. Shidore, and S. Addison, Thermal Modeling of a PBGA for Air-Cooled Applications, Electronic
Packaging and Production, pp. 53–58, March 1998.
B. Joiner and V. Adams, Measurement and Simulation of Junction to Board Thermal Resistance and Its Application in
Thermal Modeling, Proceedings of SemiTherm, San Diego, 1999, pp. 212–220.
D
T
JA
JC
CA
JT
= junction to ambient thermal resistance (°C/W)
= junction to case thermal resistance (°C/W)
= case to ambient thermal resistance (°C/W)
= thermocouple temperature on top of the package (°C)
= thermal characterization parameter (°C/W)
= power dissipation in the package (W)
CA
JT
) can be used to determine the junction temperature with a measurement of the temperature at
. For instance, the user can change the size of the heat sink, the air flow around the device, the
U.S.A.
MPC5604P Microcontroller Data Sheet, Rev. 7
Equation
T
J
3:
= T
T
+ (
JT
x P
D
)
Eqn. 3
47