GRM21BR71H104KA01L Murata, GRM21BR71H104KA01L Datasheet - Page 154

CAPACITOR, 0805 100NF 50V CAPACITOR, 0805 100NF 50V

GRM21BR71H104KA01L

Manufacturer Part Number
GRM21BR71H104KA01L
Description
CAPACITOR, 0805 100NF 50V CAPACITOR, 0805 100NF 50V
Manufacturer
Murata
Series
GRM21r

Specifications of GRM21BR71H104KA01L

Tolerance (+ Or -)
10%
Voltage
50VDC
Temp Coeff (dielectric)
X7R
Operating Temp Range
-55C to 125C
Mounting Style
Surface Mount
Construction
SMT Chip
Case Style
Ceramic Chip
Failure Rate
Not Required
Wire Form
Not Required
Product Length (mm)
2mm
Product Depth (mm)
1.25mm
Product Height (mm)
1.25mm
Product Diameter (mm)
Not Requiredmm
Capacitance
.1uF
Package / Case
0805
Voltage Rating, Dc
50V
Capacitor Dielectric Type
CERAMIC MULTI-LAYER
Tolerance,
10%
Tolerance, -
10%
Temp, Op. Max
125(DEGREE C)
Temp,
ROHS COMPLIANT
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
GRM21BR71H104KA01L
Manufacturer:
MURATA
Quantity:
640 000
Part Number:
GRM21BR71H104KA01L
Manufacturer:
MURATA
Quantity:
400 000
Part Number:
GRM21BR71H104KA01L
Manufacturer:
MURATA
Quantity:
189 000
Company:
Part Number:
GRM21BR71H104KA01L
Quantity:
3 000
Part Number:
GRM21BR71H104KA01L 0805 X7R 104K 50V
Manufacturer:
MURATA/村田
Quantity:
20 000
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
(4) Results
3. Temperature Cycling for Solder Fillet Height
(1) Test Method
152
Reference Data
Solder the chips to the substrate of various test fixtures
using sufficient amounts of solder to achieve the required
fillet height. Then subject the fixtures to the cycle
illustrated at right 200 times.
q Solder Amount
w Material
e Land Dimension
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Alumina substrates are typically designed for reflow
soldering.
Glass epoxy or paper phenol substrates are typically
used for flow soldering.
Alumina
Glass epoxy
Paper phenol (Thickness: 1.64mm)
100
100
80
60
40
20
80
60
40
20
0
0
(Thickness: 0.64mm)
(Thickness: 1.64mm)
0
0
GRM21 5C (T=0.6)
GRM21 F5 (T=0.6)
Larger Fillet
Larger Fillet
2
2
Flexure (mm)
Flexure (mm)
4
4
Fillet up to Chip
Thickness
Fillet up to Chip
Thickness
6
6
8
8
[Temperature Cycling]
[Solder Amount]
[Land Dimension]
Solder to be used
Room Temperature
100
Substrate
80
60
40
20
0
0
GRM21 R7 (T=0.6)
Larger Fillet
1.5
q
w
e
+125D
-55D
1.2
2
(in mm)
1.5
Flexure (mm)
Alumina
5
4
Fillet up to Chip
Thickness
30
6Z4 Eutectic solder
Land Pattern
Glass Epoxy
Paper Phenol
Substrate
Substrate
Substrate
Alumina
5
Continued on the following page.
6
30
or Paper Phenol
Time (min.)
8
Glass Epoxy
Ag/Pd=72/28
Thickness: 10 to 12 m
Cu
Thickness: 35 m
C02E.pdf
10.12.20

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