CSTCR4M00G53Z-R0 Murata Electronics North America, CSTCR4M00G53Z-R0 Datasheet - Page 20

RESONATOR 4.00MHZ CERAMIC INDUST

CSTCR4M00G53Z-R0

Manufacturer Part Number
CSTCR4M00G53Z-R0
Description
RESONATOR 4.00MHZ CERAMIC INDUST
Manufacturer
Murata Electronics North America
Series
CERALOCK®, CSTCRr
Type
Ceramicr
Datasheets

Specifications of CSTCR4M00G53Z-R0

Frequency
4MHz
Features
Built in Capacitor
Frequency Stability
±0.2%
Frequency Tolerance
±0.5%
Impedance
60 Ohm
Capacitance
15pF
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
3-SMD, Non-Standard
Size / Dimension
0.177" L x 0.079" W (4.50mm x 2.00mm)
Height
0.045" (1.15mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
490-1217-2

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CSTCR4M00G53Z-R0
Manufacturer:
MURATA
Quantity:
240 000
3
Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
∗ CSTCC Series : within±0.3%
18
Type
Every Series
3
Deviation after Reliability Test
fosc. 0
fosc. 0
-0.05
-0.05
0.05
0.05
(%)
(%)
-0.1
-0.1
0.1
0.1
Specifications of CERALOCK
1. Shock Resistance
5. Storage at High Temperature
before test
100
Fig. 3-2 General Changes of Oscillation Frequency in Each Reliability Test (CSTLS4M00G53–B0)
Item
1000
after test
Oscillation Frequency
(from initial value)
(time)
within±0.2%
fosc. 0
fosc. 0
-0.05
-0.05
*
0.05
0.05
(%)
(%)
-0.1
-0.1
0.1
0.1
2. Solder Heat Resistance
6. Storage at Low Temperature
before test
Meets the individual
specification of each
product.
100
Others
®
1000
after test
(time)
fosc. 0
fosc. 0
-0.05
-0.05
(%)
0.05
(%)
0.05
-0.1
-0.1
0.1
0.1
before test
3. Vibration Resistance
7. Temperature Cycling
Fig. 3-3 Reflow Soldering Profile for MHz Band Chip
25
220
150
260
245
180
CERALOCK
50
after test
(cycle)
(150 to 180°C)
100
Pre-heating
60 to 120s
®
fosc. 0
fosc. 0
-0.05
-0.05
0.05
0.05
(%)
(%)
-0.1
-0.1
0.1
0.1
4. Humidity Resistance
8. Terminal Strength
before test
(220°C min.)
30 to 60s
Heating
100
Peak
Gradual
Cooling
1000
after test
(time)
P17E.pdf
10.8.3

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