AD8188ARUZ Analog Devices Inc, AD8188ARUZ Datasheet - Page 5

• Manufacturer Part Number: AD8188ARUZ
• Description: IC,ANALOG MUX,TRIPLE,2-CHANNEL,TSSOP,24PIN,PLASTIC
• Manufacturer: Analog Devices Inc
• Type: Analog Multiplexerr

Specifications of AD8188ARUZ

• Function: Multiplexer
• Circuit: 3 x 2:1
• On-state Resistance: 350 mOhm
• Voltage Supply Source: Single Supply
• Voltage - Supply, Single/dual (±): 3.5 V ~ 5.5 V
• Current - Supply: 15mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Package: 24TSSOP
• Multiplexer Architecture: 2:1
• Maximum Turn-off Time: 17(Typ)@5V ns
• Maximum Turn-on Time: 4(Typ)@5V ns
• Power Supply Type: Single
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Supply Voltage
DV
DV
V
IN0A, IN0B, IN1A, IN1B, IN2A, IN2B, V
SEL A/B, OE
Output Short-Circuit Operation
Operating Temperature Range
Storage Temperature Range
Lead Temperature Range (Soldering, 10 sec)
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
24-Lead TSSOP
1
2
Specification is for device in free air (T
Maximum internal power dissipation (PD) should be derated for ambient
temperature (T
θ
JA
CC
JA
CC
CC
is specified for the worst-case conditions, that is, a device
to D
is on a 4-layer board (2s 2p).
to D
to V
GND
EE
GND
1
A
) such that PD < (150°C T
1
A
θ
85
= 25°C).
JA
A
2
)/θ
REF
JA
.
θ
20
JC
Rating
5.5 V
5.5 V
8.0 V
8.0 V
V
D
Indefinite
–40°C to +85°C
–65°C to +150°C
300°C
EE
GND
≤ V
≤ V
Unit
°C/W
IN
IN
≤ V
≤ V
CC
CC
Rev. 0 | Page 5 of 24
MAXIMUM POWER DISSIPATION
The maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150°C. Temporarily exceeding this limit
may cause a shift in parametric performance due to a change in
the stresses exerted on the die by the package. Exceeding a
junction temperature of 175°C for an extended period can
result in device failure.
While the AD8188/AD8189 is internally short circuit protected,
this may not be sufficient to guarantee that the maximum junction
temperature (150°C) is not exceeded under all conditions. To
ensure proper operation, it is necessary to observe the
maximum power derating curves shown in Figure 3.
ESD CAUTION
2.5
2.0
1.5
1.0
0.5
0
–50 –40 –30 –20 –10
Figure 3. Maximum Power Dissipation vs. Temperature
AMBIENT TEMPERATURE (°C)
0
10 20 30 40 50 60 70 80 90
AD8188/AD8189