ADSP-BF512KSWZ-3 Analog Devices Inc, ADSP-BF512KSWZ-3 Datasheet - Page 63

• Manufacturer Part Number: ADSP-BF512KSWZ-3
• Description: Low-Power Blackfin Processor
• Manufacturer: Analog Devices Inc
• Series: Blackfin®r
• Type: Fixed Pointr

Specifications of ADSP-BF512KSWZ-3

• Interface: I²C, PPI, SPI, SPORT, UART/USART
• Clock Rate: 300MHz
• Non-volatile Memory: External
• On-chip Ram: 116kB
• Voltage - I/o: 1.8V, 2.5V, 3.3V
• Voltage - Core: 1.30V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 176-LQFP Exposed Pad, 176-eLQFP, 176-HLQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

OUTLINE DIMENSIONS
Dimensions in
1.45
1.40
1.35
0.15
0.10
0.05
ROTATED 90 ° CCW
VIEW A
ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F
SEATING
PLANE
Figure 72
12°
0.08 MAX
COPLANARITY
7°
0°
1.00 REF
0.20
0.15
0.09
are shown in millimeters.
0.75
0.60
0.45
1.60
MAX
Figure 72. 176-Lead Low Profile Quad Flat Package [LQFP_EP]
VIEW A
44
176
1
45
Rev. B | Page 63 of 68 | January 2011
COMPLIANT TO JEDEC STANDARDS MS-026-BGA-HD
Dimensions shown in millimeters
PIN 1
26.20
26.00 SQ
25.80
LEAD PITCH
BSC
0.50
(PINS DOWN)
TOP VIEW
(SQ-176-2)
24.10
24.00 SQ
23.90
0.27
0.22
0.17
133
88
132
89
NOTE: THE EXPOSED PAD IS REQUIRED TO BE ELECTRICALLY AND
132
89
133
THERMALLY CONNECTED TO GND. IMPLEMENT THIS BY
SOLDERING THE EXPOSED PAD TO A GND PCB LAND THAT IS
THE SAME SIZE AS THE EXPOSED PAD. THE GND PCB LAND
SHOULD BE ROBUSTLY CONNECTED TO THE GND PLANE IN
THE PCB WITH AN ARRAY OF THERMAL VIAS FOR BEST
PERFORMANCE.
88
BOTTOM VIEW
EXPOSED
(PINS UP)
PAD
EXPOSED PAD IS CENTERED ON
THE PACKAGE.
45
176
1
44
5.80 REF
SQ