DSPIC33EP256MU810-I/PT Microchip Technology, DSPIC33EP256MU810-I/PT Datasheet - Page 508

• Manufacturer Part Number: DSPIC33EP256MU810-I/PT
• Description: 100 PINS, 256KB Flash, 28KB RAM, 60 MHz, USB, 2xCAN, 15 DMA 100 TQFP 12x12x1mm T
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33EPr

Specifications of DSPIC33EP256MU810-I/PT

• Embedded Interface Type: I2C, SPI, UART
• No. Of I/o's: 83
• Flash Memory Size: 280KB
• Supply Voltage Range: 3V To 3.6V
• Operating Temperature Range: -40°C To +85°C
• Digital Ic Case Style: TQFP
• No. Of Pins: 100
• Rohs Compliant: Yes
• Processor Series: DSPIC33E
• Core: dsPIC
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 60 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, QEI, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 83
• Program Memory Size: 256KB (85.5K x 24)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 12K x 16
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 32x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP
• Lead Free Status / Rohs Status: Details

dsPIC33EPXXXMU806/810/814 and PIC24EPXXXGU810/814
FIGURE 32-30:
DS70616E-page 508
(CKP =
(CKP =
SS
SCK
SCK
SDO
SDI
Note: Refer to
X
X
X
X
X
0
1
)
)
Figure 32-1
SPI2 SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 0, SMP = 0) TIMING
CHARACTERISTICS
SP50
SP35
for load conditions.
SP70
SP40
SP36
MSb In
MSb
SP41
SP30,SP31
Preliminary
Bit 14 - - - -1
Bit 14 - - - - - -1
SP73
SP72
SP72
SP73
LSb
LSb In
SP52
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SP51