HIN236CP Intersil, HIN236CP Datasheet - Page 7

• Manufacturer Part Number: HIN236CP
• Description: RS232 5V 4D/3R 1UF CAPS 24PDIP
• Manufacturer: Intersil

Absolute Maximum Ratings
V
V+ to Ground (Note 2) . . . . . . . . . . . . . . . (V
V- to Ground . . . . . . . . . . . . . . . . . . . . . . .-12V < V- < (GND +0.3V)
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24V
Input Voltages
Output Voltages
Short Circuit Duration
Operating Conditions
Temperature Range
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
Electrical Specifications
SUPPLY CURRENTS
Power Supply Current, I
V+ Power Supply Current, I
No Load, T
Shutdown Supply Current, I
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS
Input Logic Low, V
Input Logic High, V
Transmitter Input Pullup Current, I
TTL/CMOS Receiver Output Voltage Low, V
TTL/CMOS Receiver Output Voltage High, V
RECEIVER INPUTS
RS-232 Input Voltage Range V
Receiver Input Impedance R
Receiver Input Low Threshold, V
Receiver Input High Threshold, V
Receiver Input Hysteresis V
2. Only HIN239. For V+ > 11V, C1 must be ≤0.1µF.
3. θ
CC
T
R
T
R
T
R
HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0
HIN2XXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40
IN
OUT
OUT
IN
OUT
OUT
to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < V
JA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V
is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
. . . . . . . . . . . . . . . . . . . .(V- -0.3V) < V
. . . . . . . . . . . . . . . . . (GND -0.3V) < V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
A
= 25
PARAMETER
o
lL
C
lH
CC
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
CC
CC
HYST
IN
(SD)
IN
7
lN
IN
P
Test Conditions: V
(H-L)
(L-H)
OH
CC
OL
RXOUT
TXOUT
-0.3V) < V+ < 13.2V
No Load,
T
No Load,
T
T
T
T
EN, Shutdown
T
I
I
V
V
V
OUT
OUT
IN
A
A
A
IN
IN
IN
IN
CC
CC
CC
< (V+ +0.3V)
< (V+ +0.3V)
< (V+ +0.3V)
= 25
= 25
= 25
, EN, Shutdown
= 0V
= ±3V
o
o
= 5V, T
= 5V, T
= 1.6mA
= -1.0mA
= +5V ±10%, T
C to 70
C to 85
o
o
o
CC
C
C
C
< 6V
A
A
o
o
= 25
= 25
C
C
TEST CONDITIONS
HIN232
HIN236-HIN238, HIN240-HIN241
HIN239
HIN239
o
o
C
C
A
= Operating Temperature Range
Thermal Information
Thermal Resistance (Typical, Note 3)
Maximum Junction Temperature (Plastic Package) . . . . . . . .150
Maximum Storage Temperature Range . . . . . . . . . -65
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300
16 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .
24 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .
16 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
44 Ld MQFP Package . . . . . . . . . . . . . . . . . . . . . . .
(SOIC, SSOP, MQFP - Lead Tips Only)
MIN
-30
2.0
2.4
3.5
3.0
0.8
0.2
-
-
-
-
-
-
-
-
-
TYP
0.4
5.0
0.1
4.6
5.0
1.2
1.7
0.5
15
5
7
1
-
-
-
-
MAX
200
+30
0.8
0.4
7.0
2.4
1.0
10
15
15
10
1
-
-
-
-
o
θ
C to 150
JA
UNITS
100
(
90
70
75
70
95
80
mA
mA
mA
mA
o
µA
µA
kΩ
V
V
V
V
V
V
V
V
V
C/W)
o
o
o
C
C
C