BAR43CFILM STMicroelectronics, BAR43CFILM Datasheet - Page 3

• Manufacturer Part Number: BAR43CFILM
• Description: DIODE SCHOTTKY 30V 100MA SOT-23
• Manufacturer: STMicroelectronics

Specifications of BAR43CFILM

• Voltage - Forward (vf) (max) @ If: 1V @ 100mA
• Current - Reverse Leakage @ Vr: 500nA @ 30V
• Current - Average Rectified (io) (per Diode): 100mA
• Voltage - Dc Reverse (vr) (max): 30V
• Reverse Recovery Time (trr): 5ns
• Diode Type: Schottky
• Speed: Small Signal =< 200mA (Io), Any Speed
• Diode Configuration: 1 Pair Common Cathode
• Mounting Type: Surface Mount
• Package / Case: SOT-23-3
• Product: Schottky Diodes
• Peak Reverse Voltage: 30 V
• Forward Continuous Current: 0.1 A
• Max Surge Current: 0.75 A
• Configuration: Dual Common Cathode
• Recovery Time: 5 ns
• Forward Voltage Drop: 1 V
• Maximum Reverse Leakage Current: 0.5 uA
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-2520-2

Figure 3: Reverse leakage current versus
reverse voltage applied (typical values)
Figure 5: Junction capacitance versus reverse
voltage applied (typical values)
Figure 7: Thermal resistance junction to
ambient versus copper surface under each
lead (Epoxy printed circuit board FR4, copper
thickness: 35µm)
10
350
300
250
200
150
1E+2
1E+0
1E+1
1E-2
5
2
1E-1
1
1
C(pF)
0
R
0
I (µA)
th(j-a)
R
5
(°C/W)
5
2
10
15
10
20
S(CU)(mm²)
V (V)
R
T =100°C
T =50°C
T =25°C
5
V (V)
j
j
j
R
25
15
30
20
10
35
40
P=0.25W
25
F=1MHz
T =25°C
j
20
45
30
30
50
Figure 4: Reverse leakage current versus
junction temperature
Figure
impedance junction to ambient versus pulse
duration (epoxy FR4 with recommended pad
layout, e(Cu)=35µm)
1.00
0.10
0.01
1E+4
1E+3
1E+2
1E+0
1E+1
1E-2
1E-1
1E-3
Z
0
I (µA)
R
th(j-a)
δ = 0.5
δ = 0.2
δ = 0.1
Single pulse
6:
/R
V =30V
R
25
th(j-a)
1E-2
Relative
50
BAR42FILM / BAR43FILM
1E-1
t (s)
p
V (V)
variation
75
R
1E+0
100
of
δ
1E+1
=tp/T
125
thermal
T
tp
1E+2
150
3/5