PMEG4010ET,215 NXP Semiconductors, PMEG4010ET,215 Datasheet - Page 7

• Manufacturer Part Number: PMEG4010ET,215
• Description: SCHOTTKY RECT 40V 1A SOT-23
• Manufacturer: NXP Semiconductors

Specifications of PMEG4010ET,215

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Voltage - Forward (vf) (max) @ If: 640mV @ 1A
• Voltage - Dc Reverse (vr) (max): 40V
• Current - Average Rectified (io): 1A (DC)
• Current - Reverse Leakage @ Vr: 100µA @ 40V
• Diode Type: Schottky
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Capacitance @ Vr, F: 50pF @ 1V, 1MHz
• Mounting Type: Surface Mount
• Product: Schottky Diodes
• Peak Reverse Voltage: 40 V
• Forward Continuous Current: 1 A
• Max Surge Current: 9 A
• Configuration: Single
• Forward Voltage Drop: 0.64 V
• Maximum Reverse Leakage Current: 100 uA
• Maximum Power Dissipation: 420 mW
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4103-2; 934061051215; PMEG4010ET T/R

NXP Semiconductors
10. Packing information
11. Soldering
PMEG4010EH_EJ_ET_4
Product data sheet
Table 9.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number
PMEG4010EH
PMEG4010EJ
PMEG4010ET
Fig 8. Reflow soldering footprint SOD123F
Fig 9. Reflow soldering footprint SOD323F (SC-90)
For further information and the availability of packing methods, see
2.1
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Dimensions in mm
1.65
Packing methods
1.6
0.95
Package
SOD123F
SOD323F
SOT23
(2 )
1.1
0.50
(2 )
Rev. 04 — 21 March 2007
Description
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4.4
2.9
1.6
3.05
2.80
2.10
1.60
4
1 A very low V
PMEG4010EH/EJ/ET
0.50
msa433
1.1 1.2
0.60
F
MEGA Schottky barrier rectifiers
Section
[1]
14.
solder lands
solder resist
occupied area
solder paste
Packing quantity
3000
-115
-115
-215
© NXP B.V. 2007. All rights reserved.
solder lands
solder resist
solder paste
occupied area
10000
-135
-135
-235
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