PMEG1030EJ,115 NXP Semiconductors, PMEG1030EJ,115 Datasheet
PMEG1030EJ,115
Specifications of PMEG1030EJ,115
934058649115
PMEG1030EJ T/R
PMEG1030EJ T/R
Related parts for PMEG1030EJ,115
PMEG1030EJ,115 Summary of contents
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PMEG1030EH; PMEG1030EJ ultra low V Rev. 04 — 15 January 2010 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection encapsulated in ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin 1 2 [1] The marking bar indicates the cathode. 3. Ordering information Table 4. Type number PMEG1030EH PMEG1030EJ 4. Marking Table 5. Type number PMEG1030EH PMEG1030EJ PMEG1030EH_EJ_4 Product data sheet PMEG1030EH; PMEG1030EJ ultra low V Pinning Description cathode anode Ordering information Package ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V reverse voltage R I forward current F I repetitive peak forward FRM current I non-repetitive peak forward FSM current P total power dissipation tot T junction temperature j T ambient temperature ...
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... NXP Semiconductors 7. Characteristics Table 8. ° amb Symbol [1] Pulse test ( (1) (2) (3) ( − 0.1 0.2 0.3 = 125 °C (1) T amb = 85 °C (2) T amb = 25 °C (3) T amb = −40 °C (4) T amb Fig 1. Forward current as a function of forward voltage; typical values PMEG1030EH_EJ_4 Product data sheet PMEG1030EH ...
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... NXP Semiconductors = 25 ° MHz T amb Fig 3. Diode capacitance as a function of reverse voltage; typical values 8. Package outline 1.7 1.5 1 3.6 2.7 3.4 2.5 2 0.70 0.55 Dimensions in mm Fig 4. Package outline SOD123F 9. Packing information Table 9. Packing methods The -xxx numbers are the last three digits of the 12NC ordering code. ...
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... NXP Semiconductors 10. Soldering 2.1 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 6. Reflow soldering footprint SOD123F Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 7. Reflow soldering footprint SOD323F (SC-90) PMEG1030EH_EJ_4 Product data sheet PMEG1030EH; PMEG1030EJ ultra low V 4 ...
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... Revision history Table 10. Revision history Document ID Release date PMEG1030EH_EJ_4 20100115 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. PMEG1030EH_EJ_3 20050602 PMEG1030EH_EJ_2 20050405 PMEG1030EJ_1 20050124 ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Packing information . . . . . . . . . . . . . . . . . . . . . 5 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Legal information ...