BAS516,115 NXP Semiconductors, BAS516,115 Datasheet - Page 12

DIODE SW 75V 250MA HS SOD523

BAS516,115

Manufacturer Part Number
BAS516,115
Description
DIODE SW 75V 250MA HS SOD523
Manufacturer
NXP Semiconductors
Datasheets

Specifications of BAS516,115

Package / Case
SC-79, SOD-523
Voltage - Forward (vf) (max) @ If
1.25V @ 150mA
Voltage - Dc Reverse (vr) (max)
100V
Current - Average Rectified (io)
250mA (DC)
Current - Reverse Leakage @ Vr
500nA @ 80V
Diode Type
Standard
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)
4ns
Capacitance @ Vr, F
1pF @ 0V, 1MHz
Mounting Type
Surface Mount
Product
Switching Diodes
Peak Reverse Voltage
85 V
Forward Continuous Current
0.25 A
Max Surge Current
4 A
Configuration
Single
Recovery Time
4 ns
Forward Voltage Drop
1.25 V
Maximum Reverse Leakage Current
1 uA
Operating Temperature Range
+ 150 C
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Rectifier Type
Switching Diode
Peak Rep Rev Volt
85V
Avg. Forward Curr (max)
0.25
Rev Curr
1uA
Peak Non-repetitive Surge Current (max)
4A
Forward Voltage
1.25V
Operating Temp Range
-65C to 150C
Package Type
SOD-523
Rev Recov Time
4ns
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-1603-2
934055217115
BAS516 T/R

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAS516,115
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
BAS16_SER_5
Product data sheet
Fig 19. Reflow soldering footprint BAS16H (SOD123F)
Fig 20. Reflow soldering footprint BAS16J (SOD323F)
1.65
2.1
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Reflow soldering is the only recommended soldering method.
0.95
1.6
(2 )
(2 )
0.5
0.6
(2 )
1.1
Rev. 05 — 25 August 2008
3.05
2.2
2.1
4.4
2.9
1.6
4
0.5 (2 )
1.1 1.2
0.6 (2 )
High-speed switching diodes
BAS16 series
Dimensions in mm
© NXP B.V. 2008. All rights reserved.
solder lands
solder resist
solder paste
occupied area
solder lands
solder resist
solder paste
occupied area
sod323f_fr
12 of 20

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