STTH10R04G-TR STMicroelectronics, STTH10R04G-TR Datasheet - Page 5

• Manufacturer Part Number: STTH10R04G-TR
• Description: DIODE ULT FAST 400V 10A D2PAK
• Manufacturer: STMicroelectronics

Specifications of STTH10R04G-TR

• Voltage - Forward (vf) (max) @ If: 1.7V @ 10A
• Voltage - Dc Reverse (vr) (max): 400V
• Current - Average Rectified (io): 10A
• Current - Reverse Leakage @ Vr: 10µA @ 400V
• Diode Type: Standard
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 40ns
• Mounting Type: Surface Mount
• Package / Case: D²Pak, TO-263 (2 leads + tab)
• Product: Ultra Fast Recovery Rectifier
• Configuration: Single
• Reverse Voltage: 400 V
• Forward Voltage Drop: 1.7 V
• Recovery Time: 40 ns
• Forward Continuous Current: 10 A
• Max Surge Current: 100 A
• Reverse Current Ir: 10 uA
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 175 C
• Minimum Operating Temperature: - 65 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Capacitance @ Vr, F: -
• Lead Free Status / Rohs Status: Details
• Other names: 497-7575-2; STTH10R04G-TR

STTH10R04
Figure 11. Forward recovery time
Figure 13. Thermal resistance, junction to
80
70
60
50
40
30
20
10
200
180
160
140
120
100
0
80
60
40
20
0
0
t (ns)
0
fr
50
5
versus dI
ambient, versus copper surface
under tab (epoxy printed board
FR4, copper thickness = 35 µm)
D
100
2
PAK
10
150
15
200
dI /dt(A/µs)
F
F
S
/dt (typical values)
CU
(cm²)
250
20
300
25
350
30
V
FR
400
=1.1 x V
T
I
j
F
=125°C
=I
F(AV)
D²PAK
35
F
450
max.
500
40
Figure 12. Junction capacitance versus
Figure 14. Thermal resistance, junction to
100
10
100
90
80
70
60
50
40
30
20
10
0
1
0
5
reverse voltage applied (typical
values)
ambient, versus copper surface
under tab (epoxy printed board
FR4, copper thickness = 35 µm)
DPAK
10
10
15
V
R
S
(V)
CU
20
(cm²)
25
100
Characteristics
30
V
OSC
F=1MHz
T
=30mV
j
=25°C
35
DPAK
RMS
1000
40
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