BSS87,115 NXP Semiconductors, BSS87,115 Datasheet - Page 3

MOSFET N-CH 200V 400MA SOT-89

BSS87,115

Manufacturer Part Number
BSS87,115
Description
MOSFET N-CH 200V 400MA SOT-89
Manufacturer
NXP Semiconductors
Series
TrenchMOS™r
Type
Power MOSFETr
Datasheet

Specifications of BSS87,115

Package / Case
SC-62, SOT-89, TO-243 (3 Leads + Tab)
Mounting Type
Surface Mount
Power - Max
1W
Fet Type
MOSFET N-Channel, Metal Oxide
Vgs(th) (max) @ Id
2.8V @ 1mA
Current - Continuous Drain (id) @ 25° C
400mA
Drain To Source Voltage (vdss)
200V
Fet Feature
Standard
Rds On (max) @ Id, Vgs
3 Ohm @ 400mA, 10V
Minimum Operating Temperature
- 55 C
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
3 Ohm @ 10 V
Drain-source Breakdown Voltage
200 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
0.4 A
Power Dissipation
1000 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Number Of Elements
1
Polarity
N
Channel Mode
Enhancement
Drain-source On-res
3Ohm
Drain-source On-volt
200V
Gate-source Voltage (max)
±20V
Operating Temp Range
-55C to 150C
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
3 +Tab
Package Type
SOT-89
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Gate Charge (qg) @ Vgs
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
933943940115::BSS87 T/R::BSS87 T/R

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BSS87,115
Manufacturer:
NEXPERIA/安世
Quantity:
20 000
Part Number:
BSS87,115
Quantity:
600
Philips Semiconductors
THERMAL CHARACTERISTICS
Note
1. Device mounted on a printed-circuit board, maximum lead length 4 mm; mounting pad for the drain lead minimum
CHARACTERISTICS
T
2001 May 18
R
V
I
I
V
R
C
C
C
Switching times (see Figs 2 and 3)
t
t
SYMBOL
SYMBOL
j
DSS
GSS
on
off
(BR)DSS
GSth
Y
th j-a
= 25 C unless otherwise specified.
DSon
iss
oss
rss
N-channel enhancement mode
vertical D-MOS transistor
fs
10
10 mm
thermal resistance from junction to ambient
drain-source breakdown voltage
drain-source leakage current
gate-source leakage current
gate-source threshold voltage
drain-source on-state resistance
transfer admittance
input capacitance
output capacitance
reverse transfer capacitance
turn-on time
turn-off time
PARAMETER
PARAMETER
I
V
V
V
I
I
I
V
f = 1 MHz
V
f = 1 MHz
V
f = 1 MHz
I
V
I
V
D
D
D
D
D
D
DS
DS
GS
DS
DS
DS
GS
GS
= 250 A; V
= 1 mA; V
= 400 mA; V
= 400 mA; V
= 250 mA; V
= 250 mA; V
= 60 V; V
= 200 V; V
= 25 V; V
= 25 V; V
= 25 V; V
= 20 V; V
= 0 to 10 V
= 0 to 10 V
3
note 1
CONDITIONS
CONDITIONS
GS
GS
GS
GS
GS
GS
GS
DS
DD
DD
GS
DS
= V
= 0
= 0;
= 0;
= 0;
= 0
= 25 V
= 0
= 0
= 10 V
= 50 V;
= 50 V;
DS
200
0.8
140
MIN.
VALUE
125
0.1
1.6
750
100
20
10
6
49
TYP.
Product specification
200
60
2.8
3
120
30
15
10
60
MAX.
100
BSS87
UNIT
K/W
V
nA
nA
V
mS
pF
pF
pF
ns
ns
UNIT
A

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