IRF6718L2TR1PBF International Rectifier, IRF6718L2TR1PBF Datasheet - Page 3

• Manufacturer Part Number: IRF6718L2TR1PBF
• Description: MOSFET N-CH 25V 61A DIRECTFET L6
• Manufacturer: International Rectifier
• Series: HEXFET®r

Specifications of IRF6718L2TR1PBF

• Fet Type: MOSFET N-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 0.7 mOhm @ 61A, 10V
• Drain To Source Voltage (vdss): 25V
• Current - Continuous Drain (id) @ 25° C: 61A
• Vgs(th) (max) @ Id: 2.35V @ 150µA
• Gate Charge (qg) @ Vgs: 96nC @ 4.5V
• Input Capacitance (ciss) @ Vds: 6500pF @ 13V
• Power - Max: 4.3W
• Mounting Type: Surface Mount
• Package / Case: DirectFET™ Isometric L6
• Transistor Polarity: N-Channel
• Resistance Drain-source Rds (on): 1.4 mOhms
• Drain-source Breakdown Voltage: 25 V
• Gate-source Breakdown Voltage: 20 V
• Continuous Drain Current: 270 A
• Power Dissipation: 83 W
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: IRF6718L2TR1PBFTR

ƒ
„
ˆ
P
P
P
T
T
T
R
R
R
R
R
ƒ Surface mounted on 1 in. square Cu
board (still air).
Absolute Maximum Ratings
Thermal Resistance
Notes:
www.irf.com
P
J
STG
D
D
D
θJA
θJA
θJA
θJC
θJ-PCB
Surface mounted on 1 in. square Cu board, steady state.
Used double sided cooling, mounting pad with large heatsink.
T
@T
@T
@T
C
measured with thermocouple incontact with top (Drain) of part.
A
A
C
= 25°C
= 70°C
= 25°C
0.0001
0.001
0.01
100
0.1
10
1E-006
1
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
D = 0.50
0.20
0.10
0.05
0.02
0.01
Power Dissipation
Power Dissipation
Power Dissipation
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
Linear Derating Factor
1E-005
SINGLE PULSE
( THERMAL RESPONSE )
(At lower pulse widths Zth
0.0001
fl
f
j
k
Parameter
Parameter
Ã
0.001
t 1 , Rectangular Pulse Duration (sec)
‰ Mounted on minimum footprint full size board with metalized
back and with small clip heatsink. (still air)
τ
J
0.01
JA
τ
J
τ
1
Ci= τi/Ri
τ
& Zth
‰
Š
1
Ci= τi/Ri
back and with small clip heatsink.
Mounted on minimum footprint full size board with metalized
R
θ
R
JC
is measured at
1
R
1
are combined)
0.1
τ
2
τ
R
2
2
R
2
R
τ
3
3
R
τ
3
3
1
J
Typ.
12.5
–––
–––
1.0
20
τ
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
R
4
τ
4
R
4
4
-55 to + 175
τ
A
τ
A
Max.
0.029
10
270
4.3
3.0
Ri (°C/W)
83
12.2942
14.4246
2.07265
6.20859

Max.
–––
–––
–––
1.8
35
100
18.10679
2.626824
0.007811
0.239314
τi (sec)
1000
Units
Units
°C/W
W/°C
°C
W
3