IRF9530STRR Vishay, IRF9530STRR Datasheet - Page 2

MOSFET P-CH 100V 12A D2PAK

IRF9530STRR

Manufacturer Part Number
IRF9530STRR
Description
MOSFET P-CH 100V 12A D2PAK
Manufacturer
Vishay
Datasheet

Specifications of IRF9530STRR

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
300 mOhm @ 7.2A, 10V
Drain To Source Voltage (vdss)
100V
Current - Continuous Drain (id) @ 25° C
12A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
38nC @ 10V
Input Capacitance (ciss) @ Vds
860pF @ 25V
Power - Max
3.7W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRF9530STRRPBF
Manufacturer:
IR
Quantity:
20 000
IRF9530S, SiHF9530S
Vishay Siliconix
Note
a. When mounted on 1" square PCB (FR-4 or G-10 material).
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width ≤ 300 µs; duty cycle ≤ 2 %.
www.vishay.com
2
Maximum Junction-to-Ambient
Maximum Junction-to-Ambient
(PCB Mount)
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Case (Drain)
SPECIFICATIONS T
PARAMETER
Static
Drain-Source Breakdown Voltage
V
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Drain Inductance
Internal Source Inductance
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulsed Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Forward Turn-On Time
DS
Temperature Coefficient
a
J
a
= 25 °C, unless otherwise noted
SYMBOL
SYMBOL
ΔV
R
V
t
t
I
I
C
R
V
C
V
R
R
GS(th)
DS(on)
C
Q
Q
d(on)
d(off)
I
GSS
DSS
Q
g
Q
L
t
DS
L
SM
I
t
t
on
DS
oss
t
SD
thJA
thJA
thJC
iss
rss
S
rr
gd
fs
gs
r
f
D
S
g
rr
/T
J
V
V
Between lead,
6 mm (0.25") from
package and center of
die contact
MOSFET symbol
showing the
integral reverse
p - n junction diode
T
GS
GS
J
V
R
= 25 °C, I
T
DS
Intrinsic turn-on time is negligible (turn-on is dominated by L
G
Reference to 25 °C, I
= - 10 V
= - 10 V
J
= 25 °C, I
= 12 Ω, R
= - 80 V, V
V
V
V
V
V
DS
f = 1.0 MHz, see fig. 5
DS
DS
DD
TYP.
GS
TEST CONDITIONS
-
-
-
= - 50 V, I
= - 100 V, V
= V
= - 50 V, I
F
= 0 V, I
V
V
= - 12 A, dI/dt = 100 A/µs
V
GS
DS
S
GS
D
I
GS
D
GS
= - 12 A, V
= 3.9 Ω, see fig. 10
, I
= ± 20 V
= - 25 V,
= - 12 A, V
= 0 V,
see fig. 6 and 13
D
D
= 0 V, T
= - 250 µA
D
= - 250 µA
D
I
D
= - 7.2 A
= - 12 A,
GS
= - 7.2 A
D
= 0 V
= - 1 mA
GS
J
DS
G
= 150 °C
G
= 0 V
b
= - 80 V,
b
MAX.
D
S
b
b
b
D
S
1.7
62
40
b
- 100
MIN.
- 2.0
3.7
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
S09-0017-Rev. A, 19-Jan-09
Document Number: 91077
- 0.10
TYP.
0.46
860
340
120
4.5
7.5
93
12
52
31
39
-
-
-
-
-
-
-
-
-
-
-
-
-
UNIT
°C/W
± 100
MAX.
- 100
- 500
- 4.0
0.30
- 6.3
0.92
S
- 12
- 48
240
6.8
38
21
-
-
-
-
-
-
-
-
-
-
-
-
and L
D
UNIT
)
V/°C
nA
µA
nC
nH
µC
pF
ns
ns
V
V
Ω
S
A
V

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