72V285L15TFI Integrated Device Technology (Idt), 72V285L15TFI Datasheet - Page 24

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72V285L15TFI

Manufacturer Part Number
72V285L15TFI
Description
FIFO Mem Sync Dual Depth/Width Uni-Dir 64K x 18 64-Pin STQFP Tray
Manufacturer
Integrated Device Technology (Idt)
Datasheet

Specifications of 72V285L15TFI

Package
64STQFP
Configuration
Dual
Bus Directional
Uni-Directional
Density
1.125 Mb
Organization
64Kx18
Data Bus Width
18 Bit
Timing Type
Synchronous
Expansion Type
Depth|Width
Typical Operating Supply Voltage
3.3 V
Operating Temperature
-40 to 85 °C
FIFO in the chain to go LOW after a word has been read from the last FIFO is
the sum of the delays for each individual FIFO:
where N is the number of FIFOs in the expansion and T
period. Note that extra cycles should be added for the possibility that the t
IDT72V275/72V285 3.3V CMOS SUPERSYNC FIFO
32,768 x 18 and 65,536 x 18
FWFT/SI
WRITE ENABLE
INPUT READY
DATA IN
WRITE CLOCK
For a full expansion configuration, the amount of time it takes for IR of the first
n
(N – 1)*(3*transfer clock) + 2 T
Dn
WEN
IR
WCLK
Figure 20. Block Diagram of 65,536 x 18 and 131,072 x 18 Depth Expansion
FWFT/SI
72V275
72V285
IDT
TRANSFER CLOCK
WCLK
RCLK
REN
OE
TM
OR
Qn
WCLK
is the WCLK
SKEW1
GND
n
24
specification is not met between RCLK and transfer clock, or WCLK and transfer
clock, for the IR flag.
is faster. Both these actions result in data moving, as quickly as possible, to the
end of the chain and free locations to the beginning of the chain.
The Transfer Clock line should be tied to either WCLK or RCLK, whichever
WCLK
IR
Dn
WEN
FWFT/SI
72V275
72V285
IDT
COMMERCIAL AND INDUSTRIAL
RCLK
REN
OR
OE
Qn
TEMPERATURE RANGES
OUTPUT ENABLE
n
OUTPUT READY
READ ENABLE
READ CLOCK
DATA OUT
4512 drw 23

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