MT48LC16M8A2TG-75:G Micron Technology Inc, MT48LC16M8A2TG-75:G Datasheet - Page 32

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MT48LC16M8A2TG-75:G

Manufacturer Part Number
MT48LC16M8A2TG-75:G
Description
DRAM Chip SDRAM 128M-Bit 16Mx8 3.3V 54-Pin TSOP-II Tray
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC16M8A2TG-75:G

Package
54TSOP-II
Density
128 Mb
Address Bus Width
14 Bit
Operating Supply Voltage
3.3 V
Maximum Clock Rate
133 MHz
Maximum Random Access Time
6|5.4 ns
Operating Temperature
0 to 70 °C

Available stocks

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Part Number
Manufacturer
Quantity
Price
Part Number:
MT48LC16M8A2TG-75:G
Manufacturer:
MICRON
Quantity:
28
Figure 19:
Figure 20:
PDF: 09005aef8091e66d/Source: 09005aef8091e625
128MSDRAM_2.fm - Rev. N 1/09 EN
WRITE Command
WRITE Burst
Notes:
A0–A9, A11: x4
COMMAND
1. BL = 2. DQM is LOW.
Data for any WRITE burst may be truncated with a subsequent WRITE command, and
data for a fixed-length WRITE burst may be immediately followed by data for a WRITE
command. The new WRITE command can be issued on any clock following the previous
WRITE command, and the data provided coincident with the new command applies to
the new command. An example is shown in Figure 21 on page 33. Data n + 1 is either the
last of a burst of two or the last desired element of a longer burst. The 128Mb SDRAM
uses a pipelined architecture and, therefore, does not require the 2n rule associated with
ADDRESS
A9, A11: x16
A0–A9: x8
A0–A8: x16
BA0, BA1
A11: x8
CLK
DQ
RAS#
CAS#
WE#
CKE
A10
CLK
CS#
WRITE
BANK,
COL n
TRANSITIONING DATA
T0
D
n
IN
HIGH
NOP
n + 1
T1
D
IN
DISABLE AUTO PRECHARGE
ENABLE AUTO PRECHARGE
32
NOP
ADDRESS
COLUMN
ADDRESS
T2
BANK
DON’T CARE
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DON’T CARE
T3
NOP
128Mb: x4, x8, x16 SDRAM
©1999 Micron Technology, Inc. All rights reserved.
Operations

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