LPC1850FET256,551 NXP Semiconductors, LPC1850FET256,551 Datasheet - Page 87

• Manufacturer Part Number: LPC1850FET256,551
• Description: MCU 32BIT ARM CORTEX M3 256BGA
• Manufacturer: NXP Semiconductors
• Series: LPC18xxr

Specifications of LPC1850FET256,551

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 150MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD/MMC, SPI, SSI, SSP, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 80
• Program Memory Size: -
• Program Memory Type: ROMless
• Eeprom Size: -
• Ram Size: 200K x 8
• Voltage - Supply (vcc/vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-LBGA
• Processor Series: LPC1850
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 200 KB
• Interface Type: SPI Flash (SPIFI), USB, Ethernet, LCD, External Memory Controller, I2C
• Maximum Clock Frequency: 150 MHz
• Number Of Programmable I/os: 80
• Number Of Timers: 6
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Operating Temperature Range: - 40 C to + 85 C
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-6682

NXP Semiconductors
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Dynamic characteristics . . . . . . . . . . . . . . . . . 61
ADC/DAC electrical characteristics . . . . . . . . 73
Application information. . . . . . . . . . . . . . . . . . 76
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 81
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 83
Legal information. . . . . . . . . . . . . . . . . . . . . . . 84
Contact information. . . . . . . . . . . . . . . . . . . . . 85
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
External clock . . . . . . . . . . . . . . . . . . . . . . . . . 61
IRC and RTC oscillators . . . . . . . . . . . . . . . . . 62
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SSP interface . . . . . . . . . . . . . . . . . . . . . . . . . 65
USB interface . . . . . . . . . . . . . . . . . . . . . . . . 68
Dynamic external memory interface . . . . . . . . 69
Static external memory interface . . . . . . . . . . 70
Power consumption . . . . . . . . . . . . . . . . . . . . 58
LCD panel signal usage . . . . . . . . . . . . . . . . . 76
Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . . 78
XTAL and RTCX Printed Circuit Board (PCB)
layout guidelines . . . . . . . . . . . . . . . . . . . . . . . 80
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 84
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 85
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C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
32-bit ARM Cortex-M3 microcontroller
LPC1850/30/20/10
Document identifier: LPC1850_30_20_10
Date of release: 17 February 2011
All rights reserved.