PCK9448BD,157 NXP Semiconductors, PCK9448BD,157 Datasheet
PCK9448BD,157
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935280284157
PCK9448BD
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PCK9448BD,157 Summary of contents
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PCK9448 3.3 V/2.5 V LVCMOS clock fan-out buffer Rev. 01 — 29 November 2005 1. General description The PCK9448 2.5 V compatible clock fan-out buffer targeted for high performance ...
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Philips Semiconductors 3. Ordering information Table 1: Type number PCK9448BD 4. Functional diagram Fig 1. Functional diagram of PCK9448 9397 750 12534 Product data sheet 3.3 V/2.5 V LVCMOS clock fan-out buffer Ordering information Package Name Description ...
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Philips Semiconductors 5. Pinning information 5.1 Pinning Fig 2. Pin configuration for LQFP32 5.2 Pin description Table 2: Symbol CLK_SEL CCLK PCLK PCLK CLK_STOP Q11 GND V CC 9397 750 12534 Product data sheet 3.3 V/2.5 ...
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Philips Semiconductors 6. Functional description Refer to 6.1 Function table Table 3: Control CLK_SEL OE CLK_STOP [ will high-impedance 3-state all outputs independent of CLK_STOP. 7. Limiting values Table 4: In accordance with the Absolute Maximum Rating ...
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Philips Semiconductors 8.2 Static characteristics Table 6: Static characteristics (3 + 3.3 V amb CC Symbol Parameter V HIGH-state input voltage IH V LOW-state input voltage IL V HIGH-state output voltage ...
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Philips Semiconductors 8.3 Dynamic characteristics Table 8: Dynamic characteristics (3 + 3.3 V amb CC Symbol Parameter V input voltage (peak-to-peak value) i(p-p) (PCLK, PCLK) [2] V common-mode input voltage range ...
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Philips Semiconductors Table 9: Dynamic characteristics (2 + 2.5 V amb CC Symbol Parameter V input voltage (peak-to-peak value) i(p-p) (PCLK, PCLK) [2] V common-mode input voltage range ICR (PCLK, PCLK) ...
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Philips Semiconductors CCLK or PCLK CLK_STOP Q0 to Q11 Fig 3. Output clock stop (CLK_STOP) timing diagram The variation in cycle time of a signal between adjacent cycles, over a random sample of adjacent cycle pairs. Fig 4. Cycle-to-cycle jitter ...
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Philips Semiconductors PCLK PCLK t t PLH Qn Fig 5. Propagation delay test reference (PCLK/PCLK to Qn) Fig 7. Pulse skew time (t ) test reference sk(p) t sk(o) The pin-to-pin skew is defined as the worst-case difference in propagation ...
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Philips Semiconductors 9. Application information 9.1 Driving transmission lines The PCK9448 clock driver was designed to drive high speed signals in a terminated transmission line environment. To provide the optimum flexibility to the user, the output drivers were designed to ...
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Philips Semiconductors The waveform plots of versus two lines. In both cases the drive capability of the PCK9448 output buffer is more than sufficient to drive 50 measurement in the simulations a delta of only 43 ps exists between the ...
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Philips Semiconductors Fig 14. Optimized dual line termination 9.2 Power consumption of the PCK9448 and thermal management The PCK9448 dynamic electrical (AC) specification is guaranteed for the entire operating frequency range up to 350 MHz. The PCK9448 power consumption and ...
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Philips Semiconductors tot + Equation signal duty cycle. If transmission lines are used, C eliminated. In general, the use of controlled transmission line techniques eliminates the impact of the ...
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Philips Semiconductors 10. Test information Fig 15. CCLK AC test reference for V Fig 16. PCLK AC test reference 9397 750 12534 Product data sheet 3.3 V/2.5 V LVCMOS clock fan-out buffer PCK9448 ...
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Philips Semiconductors 11. Package outline LQFP32: plastic low profile quad flat package; 32 leads; body 1 pin 1 index DIMENSIONS (mm are the original dimensions) ...
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Philips Semiconductors 12. Soldering 12.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...
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Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...
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Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...
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Philips Semiconductors 15. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
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Philips Semiconductors 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...