PCK940LBD,151 NXP Semiconductors, PCK940LBD,151 Datasheet

PCK940LBD,151

Manufacturer Part Number

PCK940LBD,151

Description

IC CLOCK DISTR 1:18 32LQFP

Manufacturer

NXP Semiconductors

Type

Fanout Buffer (Distribution), Multiplexerr

Datasheet

1.PCK940LBD151.pdf (16 pages)

Specifications of PCK940LBD,151

Number Of Circuits

Ratio - Input:output

1:18

Differential - Input:output

Yes/Yes

Input

LVCMOS, LVPECL

Output

LVCMOS

Frequency - Max

250MHz

Voltage - Supply

2.375 V ~ 3.465 V

Operating Temperature

0°C ~ 70°C

Mounting Type

Surface Mount

Package / Case

32-LQFP

Frequency-max

250MHz

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

568-3642-5
935281611151
PCK940LBD-S

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

BOSTOCK HK LIMITED

Part Number:

PCK940LBD,151

Manufacturer:

NXP Semiconductors

Quantity:

10 000

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1. General description

2. Features

The PCK940L is a 1 : 18 low voltage clock distribution chip with 2.5 V or 3.3 V LVCMOS

output capabilities. The device features the capability to select either a differential

LVPECL or an LVCMOS compatible input. The 18 outputs are 2.5 V or 3.3 V LVCMOS

compatible and feature the drive strength to drive 50

transmission lines. With output-to-output skews of 150 ps, the PCK940L is ideal as a clock

distribution chip for the most demanding of synchronous systems. The 2.5 V outputs also

make the device ideal for supplying clocks for a high performance microprocessor based

design.

With a low output impedance of approximately 20 , in both the HIGH and LOW logic

states, the output buffers of the PCK940L are ideal for driving series terminated

transmission lines. With an output impedance of 20 , the PCK940L has the capability of

driving two series terminated transmission lines from each output. This gives the

PCK940L an effective fan-out of 1 : 36. If a lower output impedance is desired, please see

the PCK942C data sheet.

The differential LVPECL inputs of the PCK940L allow the device to interface directly with a

LVPECL fan-out buffer like the PCKEP111 to build very wide clock fan-out trees or to

couple to a high frequency clock source. The LVCMOS input provides a more standard

interface for applications requiring only a single clock distribution chip at relatively low

frequencies. In addition, the two clock sources can be used to provide for a test clock

interface as well as the primary system clock. A logic HIGH on the LVCMOS_CLKSEL pin

will select the LVCMOS level clock input. All inputs of the PCK940L have internal

pull-up/pull-down resistors so they can be left open if unused.

The PCK940L is a single or dual supply device. The device power supply offers a high

degree of ﬂexibility. The device can operate with a 3.3 V core and 3.3 V output, a 3.3 V

core and 2.5 V outputs, as well as a 2.5 V core and 2.5 V outputs. The 32-lead LQFP

package was chosen to optimize performance, board space and cost of the device. The

32-lead LQFP package has a 7 mm

spacing.

PCK940L

Low voltage 1 : 18 clock distribution chip

Rev. 01 — 4 April 2006

LVPECL or LVCMOS clock input

2.5 V LVCMOS outputs for Pentium II microprocessor support

150 ps maximum output-to-output skew

Maximum output frequency of 250 MHz at 3.3 V V

32-lead LQFP packaging

7 mm body size with a conservative 0.8 mm pin

series or parallel terminated

Product data sheet

Related parts for PCK940LBD,151

PCK940LBD,151 Summary of contents

Page 1

PCK940L Low voltage clock distribution chip Rev. 01 — 4 April 2006 1. General description The PCK940L low voltage clock distribution chip with 2 3.3 V LVCMOS output capabilities. The ...

Philips Semiconductors I Dual or single supply voltage: N Dual V N Single 3 Single 2 Ordering information Table 1. Type number PCK940LBD 4. Functional diagram Fig 1. Functional diagram of PCK940L PCK940L_1 Product ...

Page 3

Philips Semiconductors 5. Pinning information 5.1 Pinning Fig 2. Pin conﬁguration for LQFP32 5.2 Pin description Table 2. Symbol PECL_CLK PECL_CLK LVCMOS_CLK LVCMOS_CLKSEL Q0 to Q17 GND1 GND2 V CC1 V CC2 PCK940L_1 Product data sheet GND1 1 GND2 2 ...

Page 4

Philips Semiconductors 6. Functional description Refer to 6.1 Function table Table 3. LVCMOS_CLKSEL 0 1 Table 4. Supply pin V CC2 V CC1 7. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V ...

Page 5

Philips Semiconductors Table 7. Static characteristics (3 3.3 V amb CC2 Symbol Parameter V HIGH-level input voltage IH V LOW-level input voltage IL V peak-to-peak input voltage i(p-p) V ...

Page 6

Philips Semiconductors 9. Dynamic characteristics Table 9. Dynamic characteristics (3 3.3 V amb CC2 Symbol Parameter f maximum operating frequency oper(max) t LOW-to-HIGH propagation PLH delay t output skew ...

Page 7

Philips Semiconductors Table 10. Dynamic characteristics (3 3.3 V amb CC2 Symbol Parameter f maximum operating frequency oper(max) t LOW-to-HIGH propagation PLH delay t output skew time sk(o) t ...

Page 8

Philips Semiconductors Table 11. Dynamic characteristics (2 2.5 V amb CC2 Symbol Parameter f maximum operating frequency oper(max) t LOW-to-HIGH propagation PLH delay t output skew time sk(o) t ...

Page 9

Philips Semiconductors 9.1 Timing diagrams PECL_CLK V i(p-p) PECL_CLK Fig 3. Propagation delay (t ) test reference 100 %) The time from the PLL controlled edge ...

Page 10

Philips Semiconductors 10. Test information Fig 8. LVCMOS_CLK PCK940L AC test reference for V Fig 9. PECL_CLK PCK940L AC test reference for V PCK940L_1 Product data sheet Low voltage clock distribution chip DIFFERENTIAL ...

Page 11

Philips Semiconductors 11. Package outline LQFP32: plastic low profile quad flat package; 32 leads; body 1 pin 1 index DIMENSIONS (mm are the original dimensions) ...

Page 12

Philips Semiconductors 12. Soldering 12.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...

Page 13

Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...

Page 14

Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...

Page 15

Philips Semiconductors 15. Legal information 15.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualiﬁcation Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...

Page 16

Philips Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

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