PCK942CBD,151 NXP Semiconductors, PCK942CBD,151 Datasheet
PCK942CBD,151
Specifications of PCK942CBD,151
PCK942CBD-S
PCK942CBD-S
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PCK942CBD,151 Summary of contents
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PCK942C Low voltage clock distribution chip Rev. 01 — 15 February 2006 1. General description The PCK942C low voltage clock distribution chip with 2 3.3 V LVCMOS output capabilities. The ...
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Philips Semiconductors 3. Ordering information Table 1: Type number PCK942CBD 4. Functional diagram Fig 1. Functional diagram of PCK942C 5. Pinning information 5.1 Pinning Fig 2. Pin configuration for LQFP32 PCK942C_1 Product data sheet Ordering information Package Name Description LQFP32 ...
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Philips Semiconductors 5.2 Pin description Table 2: Symbol LVCMOS_CLK Q17 n.c. GND Functional description Refer to 6.1 Function table Table Limiting values Table 4: In accordance with the Absolute ...
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Philips Semiconductors 8. Static characteristics Table + amb Symbol CC(max) Table ...
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Philips Semiconductors 9. Dynamic characteristics Table amb Symbol f oper(max) t PLH t sk(o) t sk(pr [1] Tested using standard input levels, production tested @ 133 ...
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Philips Semiconductors 10. Package outline LQFP32: plastic low profile quad flat package; 32 leads; body 1 pin 1 index DIMENSIONS (mm are the original dimensions) ...
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Philips Semiconductors 11. Soldering 11.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...
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Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...
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Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...
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Philips Semiconductors 14. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
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Philips Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...