PCK942PBD,151 NXP Semiconductors, PCK942PBD,151 Datasheet
PCK942PBD,151
Specifications of PCK942PBD,151
PCK942PBD-S
PCK942PBD-S
Available stocks
Related parts for PCK942PBD,151
PCK942PBD,151 Summary of contents
Page 1
PCK942P Low voltage clock distribution chip Rev. 01 — 17 February 2006 1. General description The PCK942P low voltage clock distribution chip with 2 3.3 V LVCMOS output capabilities. The ...
Page 2
Philips Semiconductors 3. Ordering information Table 1: Type number PCK942PBD 4. Functional diagram Fig 1. Functional diagram of PCK942P 5. Pinning information 5.1 Pinning Fig 2. Pin configuration for LQFP32 9397 750 12261 Product data sheet Ordering information Package Name ...
Page 3
Philips Semiconductors 5.2 Pin description Table 2: Symbol GND OE n.c. PECL_CLK, PECL_CLK Q[0:17 Functional description 6.1 Function table Table Limiting values Table 4: In accordance with the Absolute Maximum Rating System ...
Page 4
Philips Semiconductors 8. Static characteristics Table 5: Static characteristics 2.5 V amb CC Symbol Parameter V HIGH-state input voltage IH V LOW-state input voltage IL V peak-to-peak input voltage i(p-p) V ...
Page 5
Philips Semiconductors 9. Dynamic characteristics Table 7: Dynamic characteristics 2.5 V amb CC Symbol Parameter f maximum operating frequency oper(max) t LOW-to-HIGH propagation delay PLH t HIGH-to-LOW propagation delay PHL t ...
Page 6
Philips Semiconductors 10. Package outline LQFP32: plastic low profile quad flat package; 32 leads; body 1 pin 1 index DIMENSIONS (mm are the original dimensions) ...
Page 7
Philips Semiconductors 11. Soldering 11.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...
Page 8
Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...
Page 9
Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...
Page 10
Philips Semiconductors 14. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
Page 11
Philips Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...