ISL98003CNZ-165 Intersil, ISL98003CNZ-165 Datasheet - Page 31

• Manufacturer Part Number: ISL98003CNZ-165
• Description: IC AFE 3CH 8BIT 165MHZ 80EPTQFP
• Manufacturer: Intersil

Specifications of ISL98003CNZ-165

• Number Of Bits: 8
• Number Of Channels: 3
• Power (watts): 1.1W
• Voltage - Supply, Analog: 1.8V, 3.3V
• Voltage - Supply, Digital: 1.65 V ~ 2 V
• Package / Case: 80-TQFP Exposed Pad, 80-eTQFP, 80-HTQFP, 80-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Thin Plastic Quad Flatpack Exposed Pad Packages (EPTQFP)
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
SEATING
PLANE
D
B
D1
B
PIN 1
12° ALL AROUND
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
12° ALL AROUND
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
1
C
REF. 6.000
For information regarding Intersil Corporation and its products, see www.intersil.com
DETAIL "Y"
b
ddd
12.000±0.100
11.950±0.100
e
31
E1
E
SIDE VIEW
C
0.200 MIN.
ALL AROUND
R0.250 TYP
0° MIN.
L1
R0.080~0.200
L
REF. 6.000
BOTTOM VIEW
PIN 1
TOP VIEW
PAD AREA
EXPOSED
9.500 REF
Y
ISL98003
NOTES:
1. General tolerance. Distance: ±0.1000, Angle: ±2.5°
2. Matte finish on package body surface except ejection and pin 1
3. All molded body sharp corner radii unless otherwise specified:
4. Package/lead frame misalignment (X, Y): MAX. 0.127
5. Top/bottom package misalignment (X, Y): MAX. 0.127
6. Drawing does not include plastic or metal protrusion or cutting
7. Compliant to JEDEC standard MS-026.
SYMBOL
Q80.12x12
80 LEAD THIN PLASTIC QUAD FLATPACK EXPOSED PAD
PACKAGE
ddd
ccc
marking: Ra0.8~2.0um
MAX. R0.200
burr.
A1
A2
D1
E1
L1
T1
b1
A
D
E
T
L
a
b
e
0.097
0.05
0.90
13.8
11.9
13.8
11.9
0.45
0.09
0.17
0.17
MIN
-
-
-
MILLIMETERS
0.500 BASE
1.000 REF.
T
0.150
0.127
0°~7°
0.080
0.080
TYP
0.10
1.00
14.0
12.0
14.0
12.0
0.60
0.22
0.20
-
SECTION B-B
0.157 Lead base metal thickness
MAX
1.20
0.15
1.10
14.2
12.1
14.2
12.1
0.75
0.20
0.27
0.23
-
-
b1
b
Overall height
Standoff
Package thickness
Lead tip to tip
Package length
Lead tip to tip
Package width
Foot length
Lead length
Lead thickness
Foot angle
Lead width
Lead base metal width
Lead pitch
Foot coplanarity
Foot position
T1
REMARKS
September 12, 2008
Rev. 0 8/07
FN6760.0