MCP4161-502E/SN Microchip Technology, MCP4161-502E/SN Datasheet - Page 3

• Manufacturer Part Number: MCP4161-502E/SN
• Description: IC POT DGTL SNGL 5K SPI 8SOIC
• Manufacturer: Microchip Technology

Specifications of MCP4161-502E/SN

• Package / Case: 8-SOIC (3.9mm Width)
• Taps: 257
• Resistance (ohms): 5K
• Number Of Circuits: 1
• Temperature Coefficient: 150 ppm/°C Typical
• Memory Type: Non-Volatile
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Resistance In Ohms: 5K
• Number Of Pots: Single
• Taps Per Pot: 256
• Resistance: 5 KOhms
• Wiper Memory: Non Volatile
• Digital Interface: Serial (4-Wire, SPI)
• Operating Supply Voltage: 2.5 V, 3.3 V, 5 V
• Supply Current: 550 uA
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.8 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

1.0
Absolute Maximum Ratings †
Voltage on V
Voltage on CS, SCK, SDI, SDI/SDO, WP, and
SHDN with respect to V
Voltage on all other pins (PxA, PxW, PxB, and
SDO) with respect to V
Input clamp current, I
(V
Output clamp current, I
(V
Maximum output current sunk by any Output pin
Maximum output current sourced by any Output pin
Maximum current out of V
Maximum current into V
Maximum current into P
Storage temperature ....................................-65°C to +150°C
Ambient temperature with power applied
Total power dissipation (Note 1) ................................400 mW
Soldering temperature of leads (10 seconds) ............. +300°C
ESD protection on all pins .................................. ≥ 4 kV (HBM),
Maximum Junction Temperature (T
© 2008 Microchip Technology Inc.
......................................................................................25 mA
......................................................................................25 mA
.......................................................................... ≥ 300V (MM)
.....................................................................-40°C to +125°C
I
O
Note 1: Power dissipation is calculated as follows:
< 0, V
< 0 or V
I
ELECTRICAL
CHARACTERISTICS
> V
O
DD
DD
> V
with respect to V
, V
DD
I
) ..................................................±20 mA
> V
P
IK
dis
SS ............................
OK
SS ......................................
PP ON
DD
X
A, P
= V
SS
pin ....................................100 mA
pin .................................100 mA
X
DD
HV pins) ......................±20 mA
W & P
SS
x {I
J
............... -0.6V to +7.0V
) ......................... +150°C
DD
X
B pins ............±2.5 mA
- ∑ I
-0.3V to V
OH
-0.6V to 12.5V
} + ∑ {(V
DD
+ 0.3V
MCP414X/416X/424X/426X
DD
-V
OH
) x I
OH
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
} + ∑(V
OI
x I
OL
)
DS22059B-page 3