X9C103PZ Intersil, X9C103PZ Datasheet - Page 2

• Manufacturer Part Number: X9C103PZ
• Description: IC POT DGTL CONTROL 10K OHM 8DIP
• Manufacturer: Intersil
• Series: XDCP™r

Specifications of X9C103PZ

• Taps: 100
• Resistance (ohms): 10K
• Number Of Circuits: 1
• Temperature Coefficient: 300 ppm/°C Typical
• Memory Type: Non-Volatile
• Interface: Up/Down (3-Wire)
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Resistance In Ohms: 10K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Ordering Information
X9C102P
X9C102PZ (Notes 1, 2)
X9C102PI
X9C102PIZ (Notes 1, 2)
X9C102S*
X9C102SZ* (Note 1)
X9C102SI*
X9C102SIZ*
X9C103P
X9C103PZ (Notes 1, 2)
X9C103PI
X9C103PIZ (Note 1)
X9C103S*
X9C103SZ*
X9C103SI*
X9C103SIZ*
X9C503P
X9C503PZ (Notes 1, 2)
X9C503PI
X9C503PIZ (Notes 1, 2)
X9C503S*
X9C503SZ* (Note 1)
X9C503SI*
X9C503SIZ*
X9C104P
X9C104PI
X9C104PIZ (Notes 1, 2)
X9C104S*
X9C104SZ*
X9C104SI*
X9C104SIZ*
*Add “T1” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
**Add “T2” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%
2. Pb-free PDIPs can be used for through-hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering
operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free
requirements of IPC/JEDEC J STD-020.
NUMBER
PART
,
,
,
,
,
,
,
**
**
**
,
,
**
**
**
**
,
,
,
,
** (Note 1)
** (Note 1)
** (Note 1)
** (Note 1)
** (Note 1)
** (Note 1)
X9C102P
X9C102P Z
X9C102P I
X9C102P ZI
X9C102S
X9C102S Z
X9C102S I
X9C102S ZI
X9C103P
X9C103P Z
X9C103P I
X9C103P ZI
X9C103S
X9C103S Z
X9C103S I
X9C103S ZI
X9C503P
X9C503P Z
X9C503P I
X9C503P ZI
X9C503S
X9C503S Z
X9C503S I
X9C503S ZI
X9C104P
X9C104P I
X9C104P ZI
X9C104S
X9C104S Z
X9C104S I
X9C104S ZI
2
MARKING
PART
X9C102, X9C103, X9C104, X9C503
R
(kΩ)
TOTAL
100
10
50
1
TEMP RANGE
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
(°C)
8 Ld PDIP
8 Ld PDIP (Pb-free)
8 Ld PDIP
8 Ld PDIP (Pb-free)
8 Ld SOIC
8 Ld SOIC (Pb-free)
8 Ld SOIC
8 Ld SOIC (Pb-free)
8 Ld PDIP
8 Ld PDIP (Pb-free)
8 Ld PDIP
8 Ld PDIP (Pb-free)
8 Ld SOIC
8 Ld SOIC (Pb-free)
8 Ld SOIC
8 Ld SOIC (Pb-free)
8 Ld PDIP
8 Ld PDIP (Pb-free)
8 Ld PDIP
8 Ld PDIP (Pb-free)
8 Ld SOIC
8 Ld SOIC (Pb-free)
8 Ld SOIC
8 Ld SOIC (Pb-free)
8 Ld PDIP
8 Ld PDIP
8 Ld PDIP (Pb-free)
8 Ld SOIC
8 Ld SOIC (Pb-free)
8 Ld SOIC
8 Ld SOIC (Pb-free)
PACKAGE
MDP0031
MDP0031
MDP0031
MDP0031
MDP0027
MDP0027
MDP0027
MDP0027
MDP0031
MDP0031
MDP0031
MDP0031
MDP0027
MDP0027
MDP0027
MDP0027
MDP0031
MDP0031
MDP0031
MDP0031
MDP0027
MDP0027
MDP0027
MDP0027
MDP0031
MDP0031
MDP0031
MDP0027
MDP0027
MDP0027
MDP0027
PACKAGE
DWG. #
July 20, 2009
FN8222.3