X9408WV24I-2.7 Intersil, X9408WV24I-2.7 Datasheet - Page 2

• Manufacturer Part Number: X9408WV24I-2.7
• Description: IC DCP QUAD 10K 64TP 24TSSOP
• Manufacturer: Intersil
• Series: XDCP™r

Specifications of X9408WV24I-2.7

• Taps: 64
• Resistance (ohms): 10K
• Number Of Circuits: 4
• Temperature Coefficient: 300 ppm/°C Typical
• Memory Type: Non-Volatile
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP
• Resistance In Ohms: 10K
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Ordering Information
*Add "T1" suffix for tape and reel. **Add "T1" suffix for tape and reel.Please refer to TB347 for details on reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
X9408YS24*
X9408YS24I*
X9408YV24*
X9408YV24Z* (Note)
X9408YV24I*
X9408YV24IZ* (Note)
X9408WS24*
X9408WS24I*
X9408WV24*
X9408WV24Z* (Note)
X9408WV24I*
X9408WV24IZ* (Note)
X9408YS24-2.7*
X9408YS24I-2.7*
X9408YV24-2.7*
X9408YV24Z-2.7* (Note)
X9408YV24I-2.7*
X9408YV24IZ-2.7T1 (Note) X9408YV Z G
X9408WS24-2.7*
X9408WS24I-2.7*
X9408WS24IZ-2.7* (Note) X9408WS Z G
X9408WV24-2.7*
X9408WV24Z-2.7* (Note)
X9408WV24I-2.7*
X9408WV24IZ-2.7* (Note) X9408WV Z G
PART NUMBER
PART MARKING V
X9408YS
X9408YS I
X9408YV
X9408YV Z
X9408YV I
X9408YV Z I
X9408WS
X9408WS I
X9408WV
X9408WV Z
X9408WV I
X9408WV Z I
X9408YS F
X9408YS G
X9408YV F
X9408YV Z F
X9408YV G
X9408WS F
X9408WS G
X9408WV F
X9408WV Z F
X9408WV G
2
CC
2.7 to 5.5
5 ±10%
LIMITS (V)
POTENTIOMETER
ORGANIZATION
X9408
(kΩ)
2.5
2.5
10
10
TEMP RANGE
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
(°C)
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) (Pb-Free)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) (Pb-Free)
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) (Pb-Free)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) (Pb-Free)
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) (Pb-Free)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) Tape and Reel
(Pb-Free)
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil) (Pb-Free)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) (Pb-Free)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) (Pb-Free)
PACKAGE
January 15, 2009
FN8191.4