PPC460EX-SUB800N AMCC, PPC460EX-SUB800N Datasheet - Page 80

• Manufacturer Part Number: PPC460EX-SUB800N
• Manufacturer: AMCC

460EX – PPC460EX Embedded Processor
Package Thermal Specifications
Table 18. Package Thermal Specifications
Thermal resistance values for the TE-PBGA package in a convection environment are as follows:
Heat Sink
The following heat sink was used in the above thermal analysis:
35W x 35L x 15H (mm)
Base thickness = 1.5mm
Fin height = 13.5mm
Fin thickness = 1.0mm
Number of Fins: 11 aluminum
80
Junction-to-ambient thermal resistance
without heat sink
Junction-to-ambient thermal resistance
with heat sink
Junction-to-case thermal resistance
Junction-to-board thermal resistance
Notes:
1. Case temperature, T
2. T
3. T
4. The preceding equations assume that the chip is mounted on a board with at least one signal and two power planes.
5. Values in the table were achieved using a JEDEC standard board with the following characteristics: 114.5mm x 101.6mm x 1.6mm, 4
6. Values for an attached heat sink were achieved with a 35mm x 35mm x 15mm unit (see Thermal Management below), attached with a
layers. The board has 100 thermal vias (same as the number of thermal balls on the TE-PBGA package).
0.1mm thickness of adhesive having a thermal conductivity of 1.3W/mK.
A
C Max
= T
=
C
− P
T
Parameter
JMax
×
θ
− P
CA
, where T
×
θ
JC
C
, is measured at top center of case surface with device soldered to circuit board.
, where T
A
is ambient temperature and P is power consumption.
JMax
is maximum junction temperature (+125°C) and P is power consumption.
Symbol
θ
θ
θ
θ
JA
JA
JC
JB
13.1
10.3
(0)
0
(0.51)
11.7
100
7.3
Resistance Value
(1.02)
10.9
200
6.1
Airflow
(m/sec)
ft/min
3.5
7.3
(1.53
10.5
300
5.6
Preliminary Data Sheet
Revision 1.19 – June 17, 2009
(2.04)
10.3
400
5.4
(2.55)
600
5.1
10
AMCC Proprietary
°C/W
°C/W
Unit
Notes
3, 6
3
3
3