PPC460EX-SUB800N AMCC, PPC460EX-SUB800N Datasheet - Page 81

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PPC460EX-SUB800N

Manufacturer Part Number
PPC460EX-SUB800N
Description
Manufacturer
AMCC
Datasheet
Revision 1.19 – June 17, 2009
Thermal Monitor
Thermal monitoring of the chip is accomplished using the PNP transistor ( β ≈ 2) provided on the chip. The collector
of the transistor is connected to ground (GND). The emitter (TherMonA) and base (TherMonB) are connected to
chip pins. A voltage measurement (V
values I
T = (q/nk)(V
Note: V
same. The small values require precision measurement and current sources.
AMCC Proprietary
Preliminary Data Sheet
1
BE2
and I
BE2
PPC460EX
and V
C
2
− V
provides the chip temperature in ° K according to the equation:
BE1
BE1
B
)/ln(I
E
should be specified in volts. I
2
/I
TherMonA
TherMonB
1
) ° K
where q = 1.602 176 53×10
BE1
V
Note: The bias voltage
and V
BE1
I
1
, I
, V
2
BE2
(Max = 300μA)
BE2
) across the TherMonA and TherMonB pins at the two current
1
and I
2
can be any units of measure provided they are the
-19
460EX – PPC460EX Embedded Processor
, n = 0.99 ± 0.05, and k = 1.380 6505×10
V
EB
should be between +0.5 V and +0.7V.
-23
.
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