MSC8113TVT3600V Freescale Semiconductor, MSC8113TVT3600V Datasheet - Page 42

• Manufacturer Part Number: MSC8113TVT3600V
• Description: DSP TRI-CORE 431-FCPBGA
• Manufacturer: Freescale Semiconductor
• Series: MSC81xx StarCorer
• Type: SC140 Corer

Specifications of MSC8113TVT3600V

• Interface: Ethernet, I²C, TDM, UART
• Clock Rate: 300MHz
• Non-volatile Memory: External
• On-chip Ram: 1.436MB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.10V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 431-FCPBGA
• Svhc: No SVHC (15-Dec-2010)
• Base Number: 8113
• Cache On Chip L1/l2 Memory: 64KB
• Core Frequency Typ: 300MHz
• Dsp Type: Tri Core
• External Supported Memory: SRAM, SDRAM
• Interface Type: TDM, I2C, UART,
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Package Information
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MSC8113 Technical Data Sheet (MSC8113). Details the signals, AC/DC characteristics, clock signal characteristics,
package and pinout, and electrical design considerations of the MSC8113 device.
MSC8113 Reference Manual (MSC8113RM). Includes functional descriptions of the extended cores and all the
internal subsystems including configuration and programming information.
Application Notes. Cover various programming topics related to the StarCore DSP core and the MSC8113 device.
SC140 DSP Core Reference Manual. Covers the SC140 core architecture, control registers, clock registers, program
control, and instruction set.
Package Information
Product Documentation
Figure 35. MSC8113 Mechanical Information, 431-pin FC-PBGA Package
MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 1
Freescale Semiconductor
Notes:
1. All dimensions in millimeters.
2. Dimensioning and tolerancing
3. Features are symmetrical about
4. Maximum solder ball diameter
5. Datum A, the seating plane, is
6. Parallelism measurement shall
7. Capacitors may not be present
8. Caution must be taken not to
9. FC CBGA (Ceramic) package
10.Pin 1 indicator can be in the
per ASME Y14.5M–1994.
the package center lines unless
dimensioned otherwise.
measured parallel to Datum A.
determined by the spherical
crowns of the solder balls.
exclude any effect of mark on
top surface of package.
on all devices.
short capacitors or exposed
metal capacitor pads on
package top.
code: 5238.
FC PBGA (Plastic) package
code: 5263.
form of number 1 marking or an
“L” shape marking.