EP2S60F672C4N Altera, EP2S60F672C4N Datasheet - Page 97

IC STRATIX II FPGA 60K 672-FBGA

EP2S60F672C4N

Manufacturer Part Number
EP2S60F672C4N
Description
IC STRATIX II FPGA 60K 672-FBGA
Manufacturer
Altera
Series
Stratix® IIr
Datasheet

Specifications of EP2S60F672C4N

Number Of Logic Elements/cells
60440
Number Of Labs/clbs
3022
Total Ram Bits
2544192
Number Of I /o
492
Voltage - Supply
1.15 V ~ 1.25 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
672-FBGA
Family Name
Stratix II
Number Of Logic Blocks/elements
60440
# I/os (max)
492
Frequency (max)
711.24MHz
Process Technology
90nm (CMOS)
Operating Supply Voltage (typ)
1.2V
Logic Cells
60440
Ram Bits
2544192
Operating Supply Voltage (min)
1.15V
Operating Supply Voltage (max)
1.25V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
672
Package Type
FC-FBGA
For Use With
544-1700 - DSP KIT W/STRATIX II EP2S60N544-1697 - NIOS II KIT W/STRATIX II EP2S60N
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Compliant
Other names
544-1913
EP2S60F672C4N

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Altera Corporation
May 2007
Each I/O bank has its own VCCIO pins. A single device can support
1.5-, 1.8-, 2.5-, and 3.3-V interfaces; each bank can support a different
V
support the voltage-referenced standards (such as SSTL-2). The PLL
banks utilize the adjacent VREF group when voltage-referenced
standards are implemented. For example, if an SSTL input is
implemented in PLL bank 10, the voltage level at VREFB7 is the reference
voltage level for the SSTL input.
I/O pins that reside in PLL banks 9 through 12 are powered by the
VCC_PLL<5, 6, 11, or 12>_OUT pins, respectively. The EP2S60F484,
EP2S60F780, EP2S90H484, EP2S90F780, and EP2S130F780 devices do not
support PLLs 11 and 12. Therefore, any I/O pins that reside in bank 11 are
powered by the VCCIO3 pin, and any I/O pins that reside in bank 12 are
powered by the VCCIO8 pin.
Each I/O bank can support multiple standards with the same V
input and output pins. Each bank can support one V
example, when V
3.3-V PCI for inputs and outputs.
On-Chip Termination
Stratix II devices provide differential (for the LVDS or HyperTransport
technology I/O standard), series, and parallel on-chip termination to
reduce reflections and maintain signal integrity. On-chip termination
simplifies board design by minimizing the number of external
termination resistors required. Termination can be placed inside the
package, eliminating small stubs that can still lead to reflections.
Stratix II devices provide four types of termination:
CCIO
Differential termination (R
Series termination (R
Series termination (R
Parallel termination (R
level independently. Each bank also has dedicated VREF pins to
CCIO
is 3.3 V, a bank can support LVTTL, LVCMOS, and
S
S
) without calibration
) with calibration
T
) with calibration
D
)
Stratix II Device Handbook, Volume 1
REF
Stratix II Architecture
voltage level. For
CCIO
2–89
for

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