EP3C25F324I7N Altera, EP3C25F324I7N Datasheet - Page 4

• Manufacturer Part Number: EP3C25F324I7N
• Description: IC CYCLONE III FPGA 25K 324 FBGA
• Manufacturer: Altera
• Series: Cyclone® IIIr

Specifications of EP3C25F324I7N

• Number Of Logic Elements/cells: 24624
• Number Of Labs/clbs: 1539
• Total Ram Bits: 608256
• Number Of I /o: 215
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 324-FBGA
• Family Name: Cyclone III
• Number Of Logic Blocks/elements: 24624
• # I/os (max): 215
• Frequency (max): 437.5MHz
• Process Technology: 65nm
• Operating Supply Voltage (typ): 1.2V
• Logic Cells: 24624
• Ram Bits: 608256
• Operating Supply Voltage (min): 1.15V
• Operating Supply Voltage (max): 1.25V
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 324
• Package Type: FBGA
• For Use With: 544-2601 - KIT DEV CYCLONE III LS EP3CLS200544-2411 - KIT DEV NIOS II CYCLONE III ED.544-2370 - KIT STARTER CYCLONE III EP3C25
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of Gates: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 544-2544

1–4
Table 1–2. Cyclone III Device Family Package Options, I/O pin and Differential Channel Counts
Cyclone III Device Handbook, Volume 1
Notes to
(1) For each device package, the first number indicates the number of the I/O pin; the second number indicates the differential channel count.
(2) For more information about device packaging specifications, refer to the
(3) The I/O pin numbers are the maximum I/O counts (including clock input pins) supported by the device package combination and can be affected
(4) All packages are available in lead-free and leaded options.
(5) Vertical migration is not supported between Cyclone III and Cyclone III LS devices.
(6) The EP3C40 device in the F780 package supports restricted vertical migration. Maximum user I/Os are restricted to 510 I/Os if you enable
(7) The E144 package has an exposed pad at the bottom of the package. This exposed pad is a ground pad that must be connected to the ground
(8) All Cyclone III device UBGA packages are supported by the Quartus II software version 7.1 SP1 and later, with the exception of the UBGA
Cyclone III
Cyclone III
Family
(8)
LS
by the configuration scheme selected for the device.
migration to the EP3C120 and are using voltage referenced I/O standards. If you are not using voltage referenced I/O standards, you can increase
the maximum number of I/Os.
plane on your PCB. Use this exposed pad for electrical connectivity and not for thermal purposes.
packages of EP3C16, which are supported by the Quartus II software version 7.2.
Table
EP3CLS100
EP3CLS150
EP3CLS200
EP3CLS70
1–2:
EP3C120
Package
EP3C10
EP3C16
EP3C25
EP3C40
EP3C55
EP3C80
EP3C5
Table 1–2
channel counts.
94, 22
94, 22
84, 19
82, 18
E144
(7)
—
—
—
—
—
—
—
—
lists Cyclone III device family package options, I/O pins, and differential
106, 28
106, 28
92, 23
M164
—
—
—
—
—
—
—
—
—
160, 47
148, 43
128, 26
P240
—
—
—
—
—
—
—
—
—
182, 68
182, 68
168, 55
156, 54
F256
—
—
—
—
—
—
—
—
Altera Device Package Information Data Sheet.
182, 68
182, 68
168, 55
156, 54
U256
—
—
—
—
—
—
—
—
215, 83
195, 61
F324
—
—
—
—
—
—
—
—
—
—
Chapter 1: Cyclone III Device Family Overview
346, 140
331, 127
327, 135
295, 113
283, 106
278, 113
278, 113
210, 87
210, 87
F484
—
—
—
© December 2009 Altera Corporation
Cyclone III Device Family Features
(Note
346, 140
331, 127
327, 135
295, 113
278, 113
278, 113
1), (2), (3), (4),
U484
—
—
—
—
—
—
535, 227
377, 163
429, 181
531, 233
413, 181
413, 181
413, 181
413, 181
F780
—
—
—
—
(5)
(6)