MPC8245TVV333D Freescale Semiconductor, MPC8245TVV333D Datasheet

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... Overview The MPC8245 integrated processor is composed of a peripheral logic block and a 32-bit superscalar MPC603e core, as shown in Figure 1. © Freescale Semiconductor, Inc., 2001–2007. All rights reserved. MPC8245EC Rev. 10, 08/2007 Contents 1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3. General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4. Electrical and Thermal Characteristics . . . . . . . . . . . . 5 5 ...

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... MMU MMU 16-Kbyte 16-Kbyte Data Instruction Cache Cache Data Bus Data Path (32- or 64-Bit) ECC Controller with 8-Bit Parity or ECC Memory Memory/ROM/ Controller PortX Control/Address SDRAM_SYNC_IN SDRAM Clocks DLL Peripheral Logic PCI_SYNC_IN PLL Fanout PCI Bus Buffers Clocks OSC_IN Freescale Semiconductor ...

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... Store gathering on peripheral logic bus-to-PCI writes — Memory interface – Gbytes of SDRAM memory – High-bandwidth data bus (32- or 64-bit) to SDRAM – Programmable timing supporting SDRAM – One to eight banks of 16-, 64-, 128-, 256-, or 512-Mbit memory devices MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Features O interface), and ...

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... PCI memory-to-local memory — Message unit – Two doorbell registers – Two inbound and two outbound messaging registers – message interface 2 2 — controller with full master/slave support that accepts broadcast messages MPC8245 Integrated Processor Hardware Specifications, Rev Freescale Semiconductor ...

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... This section provides the AC and DC electrical specifications and thermal characteristics for the MPC8245. 4.1 DC Electrical Characteristics This section covers ratings, conditions, and other DC electrical characteristics. MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor where “nominal” is 2.0/2.1 volts. ± 1 Table 2 for details of recommended operating conditions) ...

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... Unit V –0 –0 –0 /AV –0 –0 –0 105 ° –55 to 150 °C stg + 0 Recommended Unit Notes Value 1.8/1.9/2.0 V ± 100 mV 2.0/2.1 V ± 100 mV 3.3 ± 0 3.3 ± 1.8/1.9/2.0 V ± 2.0/2.1 V ± Freescale Semiconductor ...

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... AV pin, which may be reduced from V DD MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Symbol PCI inputs All other inputs + when LV is connected to a 5.0-V DC power supply. ...

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... PLL Relock 3 Time 2 Nine External Memory Clock Cycles Setup Time Maximum Rise Time Must Be Less Than One External Memory Clock Cycle Table 2 for details on this topic /GV /( /AV / Time 6 HRST_CPU, PLL HRST_CTRL Asserted 255 External Memory 3 Clock Cycles 1 Table 2. Freescale Semiconductor ...

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... Figure 5 show the undershoot and overshoot voltage of the PCI interface for the 3.3- and 5-V signals, respectively. Overvoltage Waveform Undervoltage Waveform Figure 4. Maximum AC Waveforms for 3.3-V Signaling MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor GND Not to Exceed 10 SDRAM_CLK Figure 3. Overshoot/Undershoot Voltage ...

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... Table 3. DC Electrical Specifications Table 2) 3 Condition Symbol 3 ≤ ≤ 3.465 driver-dependent 3 driver-dependent 3 p-to-p (Min) 10.75 V p-to-p (Min) Min Max Unit 0.65 × 0.3 × OV — 2.0 3.3 V GND 0.8 V — ±70 µA — ±10 µA 2.4 — V — 0.4 V Freescale Semiconductor Notes ...

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... DD DD table entry. 5. See driver bit details for output driver control register (0x73) in the MPC8245 Integrated Processor Reference Manual. 6. See Chip Errata No the MPC8245/MPC8241 RISC Microprocessor Chip Errata. MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Table 2) 3 Condition Symbol = MHz ...

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... V while the device is in doze, nap, or sleep mode 2 3.3 V where a nominal FP value, a nominal INT value, and and AV 2) < 15 mW. Guaranteed by design and not tested Unit Notes 66/133/333 66/100/350 2.3 2 2.8 2 2.4 2 1.6 1 0.7 0 0.4 0 Max Unit Notes 334 (301 800 (720 and GV supply DD DD Freescale Semiconductor ...

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... PLL_CFG[0:4] signals. Parts are sold by maximum processor core frequency. See on ordering parts. MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Table 6. Thermal Characteristics Symbol Section 9, “Ordering Information,” Electrical and Thermal Characteristics Section 7 ...

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... MHz V /AV / 2.0/2 ± 100 mV 100–333 100–350 4 50–133 50–100 for valid PLL_CFG[0:4] settings Min Max Unit 25 66 MHz — 2 — 200 ps — 250 ps — 190 ps — 100 µs See Figure 7 ns Freescale Semiconductor Unit MHz MHz MHz Notes ...

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... Figure 10 show the DLL locking range loop delay vs. frequency of operation. These graphs define the areas of DLL locking for various modes. The gray areas show where the DLL locks. MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Table 2) with LV = 3.3 V ± 0.3 V ...

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... DLL mode that is locked below tap point decimal 12 is not recommended. MPC8245 Integrated Processor Hardware Specifications, Rev Table 9. Table 9. DLL Mode Definition Bit 2 of Configuration Register at 0x76 value used for the trace length of SDRAM_SYNC_OUT to Bit 7 of Configuration Register at 0x72 Freescale Semiconductor ...

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... Figure 7. DLL Locking Range Loop Delay Versus Frequency of Operation for DLL_Extend=0 MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Propagation Delay Time (ns) loop and Normal Tap Delay Electrical and Thermal Characteristics ...

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... Electrical and Thermal Characteristics 30 27.5 25 22.5 20 17.5 15 12.5 10 7.5 0 Figure 8. DLL Locking Range Loop Delay Versus Frequency of Operation for DLL_Extend=1 MPC8245 Integrated Processor Hardware Specifications, Rev Propagation Delay Time (ns) loop and Normal Tap Delay 4 5 Freescale Semiconductor ...

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... Figure 9. DLL Locking Range Loop Delay Versus Frequency of Operation for DLL_Extend=0 MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Propagation Delay Time (ns) loop and Max Tap Delay Electrical and Thermal Characteristics ...

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... Figure 10. DLL Locking Range Loop Delay Versus Frequency of Operation for DLL_Extend=1 4.5.2 Input AC Timing Specifications Table 10 provides the input AC timing specifications at recommended operating conditions (see with LV = 3.3 V ± 0 MPC8245 Integrated Processor Hardware Specifications, Rev Propagation Delay Time (ns) loop and Max Tap Delay 4 5 Table 2) Freescale Semiconductor ...

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... Additional analyses of trace lengths and SDRAM loading must be performed to optimize timing. os For details on trace measurements and the problem of T MPC8245/MPC8241 Memory Clock Design Guidelines. MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Table 10. Input AC Timing Specifications Characteristic /2 of the rising edge of PCI_SYNC_IN to 0.4 × ...

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... Input Timing Figure 12. Input/Output Timing Diagram Referenced to PCI_SYNC_IN MPC8245 Integrated Processor Hardware Specifications, Rev 11a 2.0 V 2.0 V 0 ÷ 12a 11c 0.4 × 13b 12b-d 14b Output Timing ÷ ÷ 13a 14a 0.615 × 0.285 × Output Timing Freescale Semiconductor ...

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... Tap 2, PCI_HOLD_DEL=10, [MCP,CKE] = 01, 33-MHz PCI 13a3 Tap 3, PCI_HOLD_DEL=11, [MCP,CKE 13b Output hold (all others) 14a PCI_SYNC_IN to output high impedance (for PCI) MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor VM 10e 2 Midpoint Voltage (1 3.3 V ± 0.3 V. See Figure 11 DD Table 11 ...

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... Figure 11. Figure 15 shows the PCI_HOLD_DEL effect on output valid and hold times. Output Measurements are Made at the Device Pin = 50 Ω Ω Figure 14. AC Test Load for the MPC8245 Min Max Unit Notes — 4 0.615 × the for PCI for Memory DD Freescale Semiconductor ...

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... DC electrical characteristics for the I At recommended operating conditions with OV Parameter Input high voltage level Input low voltage level Low-level output voltage MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 13a2, 2.1 ns for 33-MHz PCI PCI_HOLD_DEL = 10 13a0 for 66-MHz PCI ...

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... I2PVKH t I2KHDX μA 10 — Min Max 0 400 4 1.3 — 4 0.6 — 4 0.6 — 4 0.6 — 4 100 — — — — 3 — 0.9 0.6 — 1.3 — 0.1 × OV — Freescale Semiconductor 2 3 Unit kHz μs μs μs μs ns μs μs μs V ...

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... The maximum t has only to be met if the device does not stretch the LOW period (t I2DXKL 4. Guaranteed by design. Figure 16 provides the AC test load for the I Output MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Electrical Specifications (continued) Table 12). Symbol V NH (first two letters of functional block)(signal)(state) (reference)(state) for outputs ...

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... V ± 5% and LV DD Min 1/14 SDRAM_SYNC_IN 40 — 0 — 1 sys_logic_clk period + 2 — Figure 18 and Figure 19, depict timing relationships to sys_logic_clk and S_CLK t I2CF t I2CR t I2PVKH 3.3 V ± 0 Max Unit 1/2 SDRAM_SYNC_IN MHz — sys_logic_clk period + 6 ns — Freescale Semiconductor Notes 1 — — — ...

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... TRST assert time 6 Input data setup time 7 Input data hold time 8 TCK to output data valid 9 TCK to output high impedance 10 TMS, TDI data setup time MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Table 2) with LV = 3.3 V ± 0.3 V. Timings are independent DD Min ...

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... TCK Data Inputs Data Outputs Data Outputs Figure 22. JTAG Boundary Scan Timing Diagram MPC8245 Integrated Processor Hardware Specifications, Rev Midpoint Voltage 4 5 Figure 21. JTAG TRST Timing Diagram Input Data Valid 8 9 Min Max Unit 15 — Output Data Valid Freescale Semiconductor Notes ...

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... The MPC8245 uses × 35 mm, cavity-up, 352-pin tape ball grid array (TBGA) package. The package parameters are as follows. Package Outline Interconnects Pitch Solder Balls Solder Ball Diameter Maximum Module Height Co-Planarity Specification Maximum Force MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 10 Input Data Valid 12 Output Data Valid × 352 1. (TBGA package) 62 Sn/36 Pb/2 Ag — ...

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... MPC8245 Integrated Processor Hardware Specifications, Rev – E – Dot on top indicates Top View corner of A1 pin on bottom 352X ∅ – T – 0.150 T MIN MAX A 34.8 35.2 B 34.8 35.2 C 1.45 1.65 D .60 .90 G 1.27 BASIC H .85 .95 K 31.75 BASIC L .50 . Freescale Semiconductor ...

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... MDH[0:31] AC17 AF16 AE16 AE14 AF14 AC13 AE12 AE11 AE10 AE9 AE8 AC7 AE7 AE6 AF5 AC5 B10 A11 A13 B13 A15 MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Table 16. MPC8245 Pinout Listing Power Type Supply PCI Interface Signals I/O ...

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... Driver Type DRV_MEM_CTRL 6 DRV_MEM_CTRL 6 DRV_MEM_CTRL 3, 4 DRV_MEM_CTRL 3, 4 DRV_MEM_CTRL 6 ohms 10, 14 DRV_MEM_CTRL 14 DRV_MEM_CTRL DRV_MEM_CTRL 6 — DRV_MEM_CTRL 10, 14 DRV_MEM_CTRL 10, 14 DRV_MEM_CTRL 10, 14 DRV_MEM_CTRL DRV_MEM_CTRL DRV_STD_MEM 6 DRV_MEM_CTRL 3 DRV_MEM_CTRL 3 DRV_MEM_CTRL 3, 4 DRV_MEM_CTRL DRV_MEM_CTRL 3, 4 — DRV_PCI DRV_PCI DRV_PCI DRV_PCI DRV_STD_MEM 10, 16 DRV_STD_MEM 10, 16 Freescale Semiconductor ...

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... SDRAM_SYNC_IN H3 CKO/DA1 B15 OSC_IN AD21 HRST_CTRL A20 HRST_CPU A19 MCP A17 NMI D16 SMI A18 SRESET/SDMA12 B16 TBEN/SDMA13 B14 MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Power Type Supply DUART Control Signals Output Output Clock-Out Signals Output GV DD Output ...

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... LV DD voltage 3.3 V, 5.0 V Power for GV DD memory drivers 3.3 V PCI/Stnd 3 Output Notes Driver Type DRV_STD_MEM 4, 14, 25 DRV_MEM_CTRL 10, 14 — 10, 14 DRV_MEM_CTRL 14 DRV_STD_MEM — 24 DRV_STD_MEM DRV_STD_MEM DRV_STD_MEM 6, 14, 20 — — 11 — — — 24 — — — — — — Freescale Semiconductor ...

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... AF26 DA4/REQ4 Y26 DA5/GNT4 W26 DA[10:6]/ A22 B19 A21 B18 B17 PLL_CFG[0:4] DA[11] AD26 DA[12:13] AF17 AF19 MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Power Type Supply Power for core V DD 1.8/2.0 V — — Power for PLL AV DD (CPU core logic) 1 ...

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... HRST_CPU/HRST_CTRL must transition from a logic logic 1 in less than one SDRAM_SYNC_IN clock cycle for the device the nonreset state MPC8245 Integrated Processor Hardware Specifications, Rev Power Type Supply Driver Type Output GV DRV_MEM_CTRL and V entries in Table Table 2 for details. so that a 1 can be detected at reset if an external DD Output Notes 2, 6 Freescale Semiconductor ...

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... F 01111 2,5 10 10000 30 –44 12 5,7 11 10001 25– 10010 60 –66 MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 9 300-MHz Part Periph PCI Clock CPU Input Logic/ MemBus Clock (PCI_ Clock Range SYNC_IN) 1 Range (MHz) Range (MHz) (MHz) 5,7 75–105 188–263 25–40 5 75– ...

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... Not usable Off 66–84 231–294 2(2) Freescale Semiconductor Mem-to- CPU (CPU VCO) 3 (2) 3.5 (2) 4 (2) 4 (2) 2 (2) 3 (2) 2.5 (2) 4 (2) 3 (2) 3 (2) 2.5 (2) Off ...

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... PLL_ Ref 10,13 CFG[0:4] (PCI_ SYNC_IN) 1 Range (MHz 00000 25–44 12 5,7 1 00001 25–37 MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 9 300-MHz Part Periph PCI Clock Logic/ CPU Input MemBus Clock (PCI_ Clock Range SYNC_IN) 1 Range (MHz) Range (MHz) (MHz) Not usable ...

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... Freescale Semiconductor Mem-to- CPU (CPU VCO) 4.5 (2) 2 (4) 2 (4) 3 (2) 3.5(2) 3 (2) 2 (2) 4.5 (2) 3 (2) 2.5 (2) 3.5 (2) 3 (2) 3 ...

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... Limited by the maximum system memory interface operating frequency (133 MHz @ 333 MHz CPU). 17. Limited by the minimum CPU operating frequency (100 MHz). 18. Limited by the minimum memory bus frequency (50 MHz). MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 9 333 MHz Part 350 MHz Part ...

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... Suggested bulk capacitors: 100–330 µF (AVX TPS tantalum or Sanyo OSCON). MPC8245 Integrated Processor Hardware Specifications, Rev Ω 2.2 µF 2.2 µF Low ESL Surface Mount Capacitors GND Figure 25. PLL Power Supply Filter Circuit Figure 25 using surface and and LV pin Freescale Semiconductor ...

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... Table 16. The following pins have internal pull-up resistors enabled only while device is in the reset state: GNT4/DA5, MDL0, FOE, RCS0, SDRAS, SDCAS, CKE, AS, MCP, MAA[0:2], and PMAA[0:2]. See Table 16. MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor , Table 10 for the input AC timing ...

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... MPC8240 backward-compatible functionality on the multiplexed signals: TBEN, CHKSTOP_IN, MPC8245 Integrated Processor Hardware Specifications, Rev Table 16. Unused active high input pins should be tied DD ) pins should be connected to a 3.3 ± 0.3 V power supply if DD 10. Timing adjustments are needed as specified for T Table 17 and Table 18. pins should be connected Freescale Semiconductor ...

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... JTAG, with additional status monitoring signals. The COP port must independently assert HRESET or TRST to control the processor. If the target system has independent MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Table 11. by more than 3 any time, including during ...

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... IC). Regardless of the numbering, the signal placement recommended in common to all known emulators. MPC8245 Integrated Processor Hardware Specifications, Rev allows the COP port to independently assert HRESET or TRST, Figure 26. Consequently, different Figure 26 is Freescale Semiconductor ...

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... If the JTAG interface is implemented, connect HRESET from the target source to TRST from the COP header through an AND gate to TRST of the part. If the JTAG interface is not implemented, connect HRESET from the target source to TRST of the part through a 0-Ω isolation resistor. MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 5 SRESET 7 ...

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... A heat sink (for example, ChipCoolers) is attached to the TBGA package, and there is low board-level thermal loading from adjacent components. MPC8245 Integrated Processor Hardware Specifications, Rev TBGA Package Heat Sink Heat Sink Clip Die Printed-Circuit Board Option Freescale Semiconductor ...

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... Chip Coolers™ P.O. Box 3668 Harrisburg, PA 17105-3668 Internet: www.chipcoolers.com MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor No heat sink and high thermal board-level loading of adjacent components No heat sink and low thermal board-level loading of adjacent components Attached heat sink and high thermal board-level loading of ...

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... If a heat sink is used, a larger percentage of heat leaves through the top side of the spreader. MPC8245 Integrated Processor Hardware Specifications, Rev Radiation Convection Heat Sink Printed-Circuit Board Radiation Convection 603-635-5102 Thermal Interface Material Die/Package Die Junction Package/Leads Freescale Semiconductor ...

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... Several commercially-available thermal interfaces and adhesive materials are provided by the following vendors: Chomerics, Inc. 77 Dragon Ct. Woburn, MA 01888-4014 Internet: www.chomerics.com MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Silicone Sheet (0.006 in.) Bare Joint Floroether Oil Sheet (0.007 in.) Graphite/Oil Sheet (0.005 in.) Synthetic Grease 20 ...

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... θJA θJC θCA where R = junction-to-ambient thermal resistance (°C/W) θ junction-to-case thermal resistance (°C/W) θ case-to-ambient thermal resistance (°C/W) θCA MPC8245 Integrated Processor Hardware Specifications, Rev 800-248-2481 888-642-7674 800-347-4572 888-246-9050 , can be obtained from the equation Freescale Semiconductor ...

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... MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at 800-854-7179 or 303-397-7956. JEDEC specifications are available on the web at http://www.jedec.org. MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor . For instance, the user can change the size of the heat θCA ) measures the temperature at the top center of the package case using the ...

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... Section 4.6 with compliant I C specifications as with other related integrated Table 2. Table 21. and AVDD DD 21: Corrected voltage range under Process Descriptor column. Minor reformatting. to 3.3 ± 5%. DD range and wording in note; Figure 11:changed wording for Table 1. Updated format Freescale Semiconductor ...

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... Changed the QACK/DA0 signal from the list of signals having an internal pull-up resistor to the list of signals needing a weak pull-up resistor to OV Section 1.9.1—Tables 21 thru 23: Added processor version register value. MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Document Revision History Substantive Change(s) for specific CPU ...

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... Section 1.7.9—Updated list for heat sink and thermal interface vendors. Section 1.9—Changed format of Ordering Information section. Added tables to reflect part number specifications also available. Added Sections 1.9.2 and 1.9.3. 0.5 — Corrected labels for Figures 5 through 8. MPC8245 Integrated Processor Hardware Specifications, Rev Substantive Change(s) and Freescale Semiconductor ...

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... Section 1.7.2—Added diode (MUR420) to Figure 27, Voltage Sequencing Circuit, to compensate for voltage extremes in design. Section 1.7.5—Added sentence with regards to SDRAM_SYNC_IN to PCI_SYNC_IN timing requirement (T Section 1.7.8—Mention of T and the MPC8245. MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Substantive Change(s) su —SDRAM_SYNC_IN to PCI_SYNC_IN Time 2.1 for power measurements (for 2-V part). DD — ...

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... Removed second sentence of the second paragraph in Section 1.7.2 because it referenced information about a 1.8-V design. Removed reference to 1 third sentence of Section 1.7.7. MPC8245 Integrated Processor Hardware Specifications, Rev Substantive Change(s) /AV / 2.0 ± 100 mV /AV /AV 2 was changed to 2.0 V for both CPU frequency offerings. Note 2 was 2 /AV / Freescale Semiconductor , and DD ...

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... Added information to Section 1.7.8 in reference to CHKSTOP_IN and SRESET being unavailable in extended ROM mode. 0.0 — Initial release. MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Substantive Change(s) / 1.8 V ± 100 mV information for 133-MHz memory interface operation (supply voltage for DLL the MPC8245 since the DLL voltage ...

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... Table 20. Part Numbering Nomenclature xx nnn Processor 1 Package Frequency (MHz TBGA 266, 300 1 2 Lead-free TBGA ZU = TBGA 333, 350 1 2 Lead-free TBGA for more information on available package types. Section 9.1, x Processor 2 Revision Level Version Register Value D:1.4 Rev ID:0x14 0x80811014 Freescale Semiconductor ...

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... Additionally, parts addressed by a hardware specifications addendum may support other maximum core frequencies. 3. Process identifier ‘A’ represents parts that are manufactured under a 29-angstrom process verses the original 35-angstrom process. MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Part Number Specification Markings (Document Order No. MPC8245ECS01AD) xx nnn ...

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... Parts are marked as the example shown in MPC8245 Integrated Processor Hardware Specifications, Rev Figure 31. MPC8245LXXnnnx ATWLYYWW CCCCC MMMMM YWWLAZ Notes : MMMMM is the 5-digit mask number. ATWLYYWW is test traceability code. YWWLAZ is the assembly traceability code. CCCCC is the country code. Figure 31. Part Marking for TBGA Device Freescale Semiconductor ...

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... THIS PAGE INTENTIONALLY LEFT BLANK MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Ordering Information 65 ...

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... Ordering Information THIS PAGE INTENTIONALLY LEFT BLANK MPC8245 Integrated Processor Hardware Specifications, Rev Freescale Semiconductor ...

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... THIS PAGE INTENTIONALLY LEFT BLANK MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Ordering Information 67 ...

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... Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer ...