MPC8250AZUPIBC Freescale Semiconductor, MPC8250AZUPIBC Datasheet - Page 31

• Manufacturer Part Number: MPC8250AZUPIBC
• Description: IC MPU POWERQUICC II 480-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIr

Specifications of MPC8250AZUPIBC

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 300MHz
• Voltage: 2V
• Mounting Type: Surface Mount
• Package / Case: 480-TBGA
• Processor Series: MPC8xxx
• Core: 603e
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 300 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: 0 C
• Core Size: 32 Bit
• Program Memory Size: 32KB
• Cpu Speed: 300MHz
• Embedded Interface Type: I2C, JTAG, SPI, UART
• Digital Ic Case Style: TBGA
• No. Of Pins: 480
• Rohs Compliant: No
• Family Name: MPC82XX
• Device Core: PowerQUICC II
• Device Core Size: 32b
• Frequency (max): 300MHz
• Instruction Set Architecture: RISC
• Operating Supply Voltage (max): 2.2V
• Operating Supply Voltage (min): 1.9V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 480
• Package Type: TBGA
• For Use With: CWH-PPC-8248N-VE - KIT EVAL SYSTEM QUICCSTART 8248
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Figure 14
Table 20
and acronyms used in
Freescale Semiconductor
BR
BG
ABB/IRQ2
TS
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
OVERBAR
MII
shows the pinout list of the TBGA package of the MPC8250.
shows the side profile of the TBGA package to indicate the direction of the top surface view.
Soldermask
1.27 mm Pitch
Polymide Tape
Symbol
Table
20.
Table 20. MPC8250 TBGA Package Pinout List
(Oxidized for Insulation)
Copper Heat Spreader
Figure 14. Side View of the TBGA Package
Pin Name
MPC8250 Hardware Specifications, Rev. 2
Table 19. Symbol Legend
Glob-Top Dam
Signals with overbars, such as TA, are active low.
Indicates that a signal is part of the media independent interface.
Glob-Top Filled Area
View
Die
Wire Bonds
Attach
Die
Meaning
Copper Traces
Table 19
Cavity
Etched
Pressure Sensitive
defines the conventions
Adhesive
Ball
W5
G1
E2
E3
H5
H2
H1
K4
K3
K2
K1
F4
J5
J4
J3
J2
J1
Pinout
31